Ultralow dielectric cross-linked silica aerogel nanocomposite films for interconnect technology

Choi, Hee Young; Kim, Tae-Hee; Kim, Tae-ho; Moon, Sunil; Yoo, Sang Hyuk; Dhavale, Rushikesh P.; Kang, Keonwook; Sohn, Hyunchul; Park, Hyung Ho

doi:10.1016/j.apmt.2022.101536

Cited by 18 publications

(15 citation statements)

References 74 publications

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“…With the rapid progress of high-frequency microwave communication technologies, an urgent need for high-performance low-dielectric materials has risen. These dielectric materials with low dielectric constant can decrease the capacitance between metal interconnects, resistance–capacitance delay, line-to-line crosstalk noise, and power dissipation, which makes them suitable as high-frequency, low-loss boards; semiconductor packaging materials (e.g., chip modules); and interlayer dielectrics (e.g., transistor devices) [ 1 , 2 , 3 , 4 , 5 , 6 , 7 , 8 ]. For example, dielectrics in printed circuit boards must have a dielectric constant ( k ) value of <2.5 and a dissipation factor of <0.002 at frequencies greater than 5 GHz in order to meet the criteria of 5G mobile communication in terms of reliability and signal delay [ 9 , 10 , 11 ].…”

Section: Introductionmentioning

confidence: 99%

Sustainable Dielectric Films with Ultralow Permittivity from Soluble Fluorinated Polyimide

Kong

Wang

et al. 2023

Molecules

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In the rapidly growing area of high-frequency communications, polyimide films with ultralow dielectric constant and dielectric loss, adequate insulating strength, and recyclability are in high demand. Using a synthesized soluble fluorinated polyimide, a series of recyclable porous dielectric films with varying porosities were fabricated in this study through nonsolvent-induced phase separation. By manipulating the mass ratio of the binary solvent used to dissolve the polyimide, the shape, size, and size distribution of the pores generated throughout the polyimide matrix can be accurately regulated. The porosity and average pore size of the as-prepared porous films were adjustable between 71% and 33% and between 9.31 and 1.00 μm, respectively, which resulted in a variable dielectric constant of 1.51–2.42 (100 kHz) and electrical breakdown strength of 30.3–119.7 kV/mm. The porous sPI film with a porosity rate of 48% displayed a low dielectric constant of 2.48 at 10 GHz. Coupled with their superior thermal stability, mechanical characteristics, and recyclability, these porous polyimide films are highly promising for constructing high-frequency microelectronic devices.

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Section: Introductionmentioning

confidence: 99%

Sustainable Dielectric Films with Ultralow Permittivity from Soluble Fluorinated Polyimide

Kong

Wang

et al. 2023

Molecules

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“…As one of the most effective ways to greatly reduce the dielectric constant of materials, the introduction of porous structure is often involved because it can accommodate a large amount of air with the lowest dielectric constant. [19][20][21][22][23] 23 A metal-organic framework of [Cu 3 (BTC) 2 ] n with highly porous structure was incorporated into cellulose nanofibrils through the solution-based strategy to prepare an ultra-low dielectric films. 24 PI aerogels in which dodecyldiamine in place of dimethylbenzidine were also prepared.…”

Section: Introductionmentioning

confidence: 99%

A promising low‐dielectric‐constant material with good comprehensive performance upon heating

Han

2023

J of Applied Polymer Sci

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The dielectric and other properties of low‐dielectric‐constant materials after heating are crucial to their performance and use, but rarely studied. In this article, sandwich‐type porous polyimide (PI) film in which porous structures located on both upper and lower surfaces of flat PI film was prepared through the simple, low‐cost and green microemulsion method. The porous structures were preserved after heating due to the usage of thermally stable fluorine‐contained PI (FPI) and PI as skeleton and substrate of the porous structure, respectively, but with the increase of pore size because of the removal of thermally unstable surfactant on the inner surface of the pores. More importantly, 2.89%–5.57% of reductions in the dielectric constant with the maintenance of low dielectric loss and water absorption and high mechanical strength were observed after heating. Therefore, the low dielectric properties of heated films were well preserved upon high humidity treatment. Moreover, the structure and properties of the heated films could be adjusted via controlling the parameters in the microemuslion method. These excellent properties after the high‐temperature treatment facilitate the application of the sandwich‐type porous PI film as dielectric materials in high‐temperature environment.

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“…[1][2][3][4][5] Such dielectric materials reduce capacitance, resistive delay, wire-to-wire crosstalk noise and power consumption between metal interconnects, 6,7 and provides significant application prospects in interlayer dielectrics, semiconductor packaging and high-frequency, low-loss boards. [8][9][10] Compared with inorganic dielectric materials, organic polymers have a lower dielectric constant, a low density and excellent processing and molding properties. 2,11 More importantly, organic polymers can modulate properties through flexible molecular design.…”

Section: Introductionmentioning

confidence: 99%

Dual cross-linking strategy to prepare fluorine-containing poly(arylene ether nitrile) films with a low dielectric constant and ultra-low water uptake

Cao

Shi

et al. 2022

Polym. Chem.

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Ultralow dielectric cross-linked silica aerogel nanocomposite films for interconnect technology

Cited by 18 publications

References 74 publications

Sustainable Dielectric Films with Ultralow Permittivity from Soluble Fluorinated Polyimide

Sustainable Dielectric Films with Ultralow Permittivity from Soluble Fluorinated Polyimide

A promising low‐dielectric‐constant material with good comprehensive performance upon heating

Dual cross-linking strategy to prepare fluorine-containing poly(arylene ether nitrile) films with a low dielectric constant and ultra-low water uptake

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