In the field of nondestructive testing (NDT), the bond defect detection of ultra-thin metal and silica gel is a difficult problem. In this study, the ultrasonic resonance method was used to evaluate the bonding quality of ul-thin metal. Study three different bond states of ultra-thin nickel sheet and silicon film composite, nickel and silica gel bond state, the absorption of ultrasonic differences, with the use of high-frequency ultrasound in ultra-thin nickel slice of resonance, through the resonance signal analysis of ultra-thin nickel sheet and silicon film combination, the bonding coefficient of the bond state between ultra-thin nickel sheet and silica gel. Through experimental comparison, the results show that the attenuation of ultrasonic signal in the nickel sheet and silicon film with different bonding states characterize the bonding state of ultra-thin nickel sheet and silicon film by the bonding coefficient, the bonding coefficient of good parts, weak adhesive parts and debonded parts is reduced successively. By setting an appropriate determination threshold value, the bonding state between the ultra-thin nickel sheet and the silicon film can be accurately determined according to the bonding coefficient obtained by detection.