Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder

Ren, Jing; Huang, Mingliang

doi:10.1080/13621718.2021.1882147

Cited by 11 publications

(1 citation statement)

References 24 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…For example, ultrasonic-assisted soldering promotes the dissolution of the Al substrate and the roughness of the Al/solder interface at a heating temperature of 300°C, which improves the brazing connection on the Al substrate. Furthermore, the Al atoms of the Al substrate migrated to the Cu substrate under ultrasonic action, which formed an Al-rich (Zn) solid solution (Ren and Huang, 2021). The Al atoms in the Cu/Sn-9Zn/Al joint dissolved into the solder under ultrasonic action at a heating temperature of 250°C, which transformed Cu 5 Zn 8 to Al 4.2 Cu 3.2 Zn 0.7 and hindered the formation of Cu 5 Zn 8 (Zhang et al , 2015).…”

Section: Introductionmentioning

confidence: 99%

Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted

Gan

Chen

Jiang

et al. 2023

SSMT

View full text Add to dashboard Cite

Purpose This study aims to research properties of Cu/SAC0307 mixed solder balls/Al joints with different bonding temperature under ultrasonic-assisted. Design/methodology/approach A new method that 1 mm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 mm were mixed to fill the joint and successfully achieved micro-joining of Cu/Al under ultrasonic-assisted. Findings The results indicated that when the bonding temperature was 180°C, there was only one layer of CuZn5 intermetallic compounds (IMCs) at the Cu interface. However, when the bonding temperature was 190°C, 200°C and 210°C, the Cu interface IMCs had two layers: for one layer, the IMCs near the Cu substrate were Cu5Zn8 and for another layer, the IMCs near the solder were CuZn5. In addition, the thickness of the Cu interfacial IMCs increased with the bonding temperature. In particular, the thickness of IMCs at the Cu interface of the Cu/Al joints soldered at 210°C was 4.6 µm, which increased by 139.6% compared with that of the Cu/Al joints soldered at 180°C. However, there was no IMC layer at the Al interface, but there might be a Zn–Al solid solution layer. The shear strength of Cu/Al joints soldered at 180°C was only 15.01 MPa, but as the soldering temperature continued to increase, the shear strength of the Cu/Al joints increased rapidly. When the soldering temperature was 200°C, the shear strength of the Cu/Al joints reached the maximum of 38.07 MPa, which was 153.6% higher than that at 180°C. When the soldering temperature was 180°C, the fracture of Cu/Al joints was mainly on the Al side. However, when soldering temperature was 190°C, 200°C and 210°C, the fracture of Cu/Al joints was mainly broken in the Zn particles layer. Originality/value A new method that 1 mm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 mm were mixed to fill the Cu/Al joint at 210°C.

show abstract

Section: Introductionmentioning

confidence: 99%

Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted

Gan

Chen

Jiang

et al. 2023

SSMT

View full text Add to dashboard Cite

show abstract

Review of ultrasonic-assisted soldering in Sn-based solder alloys

Chen

Zhang

Wang

et al. 2023

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

Fast and Reliable Ag–Sn Transient Liquid Phase Bonding by Combining Rapid Heating with Low-Power Ultrasound

Rheingans

Jeurgens

Janczak‐Rusch

2022

Metall Mater Trans A

View full text Add to dashboard Cite

Ag–Sn transient liquid phase (TLP) bonding is capable of producing joints with excellent mechanical and thermal properties, and with operation temperatures at or even above the processing temperature. However, reduction of the comparatively long processing times required to achieve high-quality joints is highly desirable. To this end, the use of fast heating and low-power ultrasonic (US) pulses for accelerated Ag–Sn TLP bonding is investigated with particular focus on defect generation and avoidance. Employing rapid heating with $$20\,{\text {K s}}^{-1}$$ 20 K s - 1 , the process time can indeed be strongly reduced, yielding a high average shear strength of $$(58 \pm 22)$$ ( 58 ± 22 ) MPa. The large variance of the shear strength is caused by gas entrapment and pronounced lateral squeeze-out of liquid Sn, facilitated by the suppression of $${\text{Ag}}_{3} {\text{Sn}}$$ Ag 3 Sn formation upon rapid heating. Introduction of a weak US pulse leads to enhanced $${\text{Ag}}_{3} {\text{Sn}}$$ Ag 3 Sn formation and efficient removal of entrapped gas, and thus to avoidance of large-scale bond defects, which results in an enhanced shear strength of $$(104 \pm 8)$$ ( 104 ± 8 ) MPa.

show abstract

Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder

Cited by 11 publications

References 24 publications

Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted

Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted

Review of ultrasonic-assisted soldering in Sn-based solder alloys

Fast and Reliable Ag–Sn Transient Liquid Phase Bonding by Combining Rapid Heating with Low-Power Ultrasound

Contact Info

Product

Resources

About