Power Ultrasonics 2015
DOI: 10.1016/b978-1-78242-028-6.00019-3
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Ultrasonic cleaning and washing of surfaces

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Cited by 54 publications
(39 citation statements)
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“…The method is based on applying short, focused, high-pressure ultrasound pulses to generate a cavitation bubble cloud inside the treated tissue. The frequencies used in current clinically approved applications are typically below 1 MHz to further enhance the cavitation, which is inversely proportional to the frequency [97]. Although this technique has shown great potential for treating pathologies such as kidney stones [98] and liver cancer [99], its efficacy is limited to situations in which a single target can be accurately visualized and linearized prior to treatment [100].…”
Section: Applications Of Acoustic Droplet Vaporizationmentioning
confidence: 99%
“…The method is based on applying short, focused, high-pressure ultrasound pulses to generate a cavitation bubble cloud inside the treated tissue. The frequencies used in current clinically approved applications are typically below 1 MHz to further enhance the cavitation, which is inversely proportional to the frequency [97]. Although this technique has shown great potential for treating pathologies such as kidney stones [98] and liver cancer [99], its efficacy is limited to situations in which a single target can be accurately visualized and linearized prior to treatment [100].…”
Section: Applications Of Acoustic Droplet Vaporizationmentioning
confidence: 99%
“…Ultrasonic cleaning is one of the vital manufacturing processes in various production industries, e.g., rubber, food, electronics, oil, and others, especially jewelry [1,2], as Thailand is one of the world's most important production bases [3]. In the jewelry industry, the shine and gloss of the goods are one of the highest concerns.…”
Section: Introductionmentioning
confidence: 99%
“…While keeping the compatibility with Si wafer standard processing steps, ultrasonic treatment of surfaces can be effective in passing several obstacles to achieving wafer cleaning mentioned above. Ultrasonic cleaning employs an ultrasonically activated liquid with a submerged wafer used to achieve or enhance the removal of surface contaminants [60]. Ultrasonic irradiation involves a variety of complex mechanisms, including mechanical vibration and appropriate pressure gradients, microcavitation bubbles that oscillate and dance around due to Bjerknes force [39,61], acoustic streaming flows, etc.…”
Section: Ultrasonic Cleaning Of Si Wafersmentioning
confidence: 99%
“…Therefore, because the bubble size drops with increasing the ultrasonic frequency and the bubble implosions become less violent, the energy released by each imploding cavitation bubble decreases with the ultrasonic frequency. However, the number of the imploding events increases due to increased number of sound waves passing through the liquid at a higher frequency [60].…”
Section: Sonochemical Passivation Of Si and Sigementioning
confidence: 99%