Ultrasonic fabrication of micro fluidic channels from polyether ether ketone (PEEK)

Kosloh, Julia; Sackmann, Johannes; Schomburg, Werner Karl

doi:10.1007/s00542-017-3284-1

Cited by 14 publications

(6 citation statements)

References 19 publications

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“…In the calculation process, the dielectric constants of materials are all derived from the experiments, and the melting points of materials are all derived from the existing literature reports, as shown in Table 1. [5,[9][10][11][12][31][32][33][34][35][36][37][38][39] Whether it is a singlephase material, composite material or multilayer material, we can observe an excellent agreement between the model-predicted value of the breakdown strength of the materials and the measured data. The data trends show that the breakdown strength decreases with increasing temperature and is also affected by an increase in dielectric constant (Figure 1).…”

Section: Resultsmentioning

confidence: 93%

Quantitative Theory for the Electrical Breakdown of High‐Temperature Dielectric Materials under High Temperature and Electric Field

Wang

2022

Advcd Theory and Sims

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The electrothermal breakdown of high-temperature dielectric materials has received increasing attention. However, the theoretical characterization of quantitative relationship between breakdown strength and temperature has been a challenge. Herein, a theory termed energy storage capacity has been developed to generate and understand the nature of this quantitative relationship. This theory defines a limit value of stored energy associated with the material breakdown, including electric energy and the equivalent heat energy. Then, a parameter-free theoretical model of temperature-dependent breakdown strength of materials is developed, which takes into account the effects of dielectric constant and melting point. This non-fitting model, without the need to carry out any destructive experiments and data fitting, is validated with excellent agreement between the predicted and measured values of both polymers and ceramics, monolithic and multilayered polymer/ceramic composites. It is shown that the failure of large classes of substances, including ceramics and polymers under heat and electrical force or mechanical force can be accurately modeled using the concept of the temperature independent limit value of the stored energy. This should become the new insight and entry point for the development of quantitative characterization of temperature-dependent physical and mechanical properties of materials. IntroductionDielectric materials are currently widely used in power electronic systems such as dielectric capacitors in hybrid electric vehicles, aerospace applications, medical equipment, electronic weapons, oil and gas exploration, and wind turbines.

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Section: Resultsmentioning

confidence: 93%

Quantitative Theory for the Electrical Breakdown of High‐Temperature Dielectric Materials under High Temperature and Electric Field

Wang

2022

Advcd Theory and Sims

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“…[ 208,209 ] Moreover, ultrasonic microwelding, which combines the advantages of inserted metal parts, local heating and high efficiency, has improved the homogeneity and emerged as a promising technique. [ 206,210,211 ] Nevertheless, explorations of new process friendly laser systems, materials compositions, and additives are among the areas of current and future trends in LTW research. [ 198 ]…”

Section: Micro/nanomachiningmentioning

confidence: 99%

Current and Future Trends for Polymer Micro/Nanoprocessing in Industrial Applications

et al. 2022

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Polymers are widely used in optical devices, electronic devices, energy‐harvesting/storage devices, and sensors, owing to their low weight, excellent flexibility, and simple fabrication process. With advancements in micro/nanoprocessing techniques and more demanding application requirements, it is becoming necessary to realize high‐resolution fabrication of polymers to prepare miniaturized devices. This is particularly because conventional processing technologies suffer from high thermal stress and strong adhesion/friction, which can irreversibly damage the micro/nanostructures of miniaturized devices. In addition, although the use of advanced fabrication methods to prepare high‐resolution micro/nanostructures is explored, these methods are limited to laboratory research or small‐batch production. This review focuses on the micro/nanoprocessing of polymeric materials and devices with high spatial precision and replication accuracy for industrial applications. Specifically, the current state‐of‐the‐art techniques and future trends for micro/nanomolding, high‐energy beam processing, and micro/nanomachining are discussed. Moreover, an overview of the fabrication and applications of various polymer‐based elements and devices such as microlenses, biosensors, and transistors is provided. These techniques are expected to be widely applied for multiscale and multimaterial processing as well as for multifunction integration in next‐generation integrated devices, such as photoelectric, smart, and biodegradable devices.

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“…Comprehensive studies have been carried out to explain the underlying physics of the process [7][8][9], and the process has been successfully applied to the manufacturing of micro uidic channels [7,10], optical diffusers [11], and even circuit boards [12,13].…”

Section: Introductionmentioning

confidence: 99%

Utilization of Cross-Correlation Function for Assessment of Replication Quality in Ultrasonic Embossing of Microchannels on Polymethyl Methacrylate (PMMA)

Yildirim,

Ulku,

Arikan

2023

Preprint

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Ultrasonic embossing is a promising method for fabricating microchannels on thermoplastics due to reduced cycle time and relatively low equipment cost. Replication quality in ultrasonic embossing has been investigated in the literature by primarily referring to the replication depth. However, this approach does not fully reflect the fidelity between the mold and the replicated feature, especially at the side walls, which are typically designed as vertical in microchannels. We propose to utilize cross-correlation between the gradients of the mold profile and the embossed profile as a figure of merit sensitive to the side wall’s fidelity. For testing purposes, we embossed straight microchannels on polymethyl methacrylate (PMMA) using a brass mold comprising 100, 300, and 1000 µm-wide protrusions of same designed height of 300 µm, resulting in aspect ratios (AR) of 3, 1, and 1/3, respectively. Cross-correlations between the gradients of the pofiles ranged between 0.50 and 1.00, while cross-correlations between the profiles were greater than 0.97 in all cases, showing the sensitivity imposed by utilizing the gradients. Setting average of all cross-correlation values (0.8) as the quality threshold, we observed that high AR (3) features were replicated at low quality, while low AR (1/3) features were replicated at high quality, regardless of the process parameters. In replicating unit AR features, the process parameters were observed to affect the quality, where the combination of vibration time and pressure was the most significant compared to individual effects of the parameters.

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Ultrasonic fabrication of micro fluidic channels from polyether ether ketone (PEEK)

Cited by 14 publications

References 19 publications

Quantitative Theory for the Electrical Breakdown of High‐Temperature Dielectric Materials under High Temperature and Electric Field

Quantitative Theory for the Electrical Breakdown of High‐Temperature Dielectric Materials under High Temperature and Electric Field

Current and Future Trends for Polymer Micro/Nanoprocessing in Industrial Applications

Utilization of Cross-Correlation Function for Assessment of Replication Quality in Ultrasonic Embossing of Microchannels on Polymethyl Methacrylate (PMMA)

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