Mainly due to their low weight, low cost and ease of assembly,\ud
the adhesive bonds have emerged as a promising technology.\ud
However, the lack of adequate tools of design and control\ud
remain an obstacle to the use of the adhesives. In this work a\ud
cohesive interface model formulated within the framework of\ud
damage mechanics is applied for the simulation of decohesion\ud
during crack propagation tests. Considering the mechanical\ud
tests of aluminium/epoxy specimens, comparisons between\ud
experimental and numerical results are presented