Ultrathin 3D FO‐WLP eWLB‐PoP (Embedded Wafer‐Level Ball Grid Array‐Package‐on‐Package) Technology

Yoon, Seung Wook

doi:10.1002/9781119313991.ch4

Cited by 2 publications

(1 citation statement)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…FO-WLP is capable of manufacturing thinfilm circuits with multilayer redistribution layers (RDLs). Signals of elements in a 2-D ultrasonic transducer array are allowed to be unconstrained for the 2-D array size [28,29]. The embedded FO-WLP can make ultrasonic transducer arrays compatible with FPCB and ASIC pitch requirements and give the flexibility of the design and fabrication of FPCB IEICE Electronics Express, Vol.VV, No.NN, 1-6 and ASIC.…”

Section: Introductionmentioning

confidence: 99%

Design, simulate and performance an embedded fan-out package for 2-D ultrasonic transducer arrays

Wan

Zhang

et al. 2021

IEICE Electron. Express

View full text Add to dashboard Cite

In this article, the embedded fan-out wafer-level packaging (FO-WLP) for 2-D ultrasonic transducer array with individual electrical connection is proposed. The finite element analysis (FEA) was employed to analyze effects of the package on ultrasonic transducers. The layout of the package was designed based on single-element FEA models. The impedance characteristic of the encapsulated array was measured. The model of encapsulated array was established. The simulation and measured results of the encapsulated array show that the effective electromechanical coupling coefficient is remarkable affected by redistribution layers (RDLs) and passivation layers (PLs). key words: 2-D ultrasonic transducer array, Embedded fan-out wafer-level package (FO-WLP), Finite element analysis (FEA). Classification: XYZ (choose one from Table II)

show abstract

Section: Introductionmentioning

confidence: 99%