Ultrathin Silicon Chips of Arbitrary Shape by Etching Before Grinding

Herwik, Stanislav; Oliver, Paul; Ruther, Patrick

doi:10.1109/jmems.2011.2148159

Cited by 71 publications

(64 citation statements)

References 16 publications

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“…This cable was electrically connected to the recording system using a custom-made electrode interface board (EIB), as shown in Figure 1A. Details on probe fabrication and assembly are described elsewhere [12,13]. The electrical interconnection between the PI cable and EIB is achieved using a 300-µm-thick flexible printed circuit board (fPCB) flip-chip bonded to the cable and a zeroinsertion-force (ZIF) connector (MOLEX, Lisle, IL, USA).…”

Section: Recording Proceduresmentioning

confidence: 99%

Application of floating silicon-based linear multielectrode arrays for acute recording of single neuron activity in awake behaving monkeys

Bonini

Maranesi

Livi

et al. 2014

Biomedical Engineering / Biomedizinische Technik

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One of the fundamental challenges in behavioral neurophysiology in awake animals is the steady recording of action potentials of many single neurons for as long as possible. Here, we present single neuron data obtained during acute recordings mainly from premotor cortices of three macaque monkeys using a silicon-based linear multielectrode array. The most important aspect of these probes, compared with similar models commercially available, is that, once inserted into the brain using a dedicated insertion device providing an intermediate probe fixation by means of vacuum, they can be released and left floating in the brain. On the basis of our data, these features appear to provide (i) optimal physiological conditions for extracellular recordings, (ii) good or even excellent signal-to-noise ratio depending on the recorded brain area and cortical layer, and (iii) extreme stability of the signal over relatively long periods. The quality of the recorded signal did not change significantly after several penetrations into the same restricted cortical sector, suggesting limited tissue damage due to probe insertion. These results indicate that these probes offer several advantages for acute neurophysiological experiments in awake monkeys, and suggest the possibility to employ them for semichronic or even chronic studies.

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Section: Recording Proceduresmentioning

confidence: 99%

Application of floating silicon-based linear multielectrode arrays for acute recording of single neuron activity in awake behaving monkeys

Bonini

Maranesi

Livi

et al. 2014

Biomedical Engineering / Biomedizinische Technik

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“…3b-iv). Finally, the wafer is ground to the required remaining thickness of 40 µm, thus completing this etching-beforegrinding process (Herwik et al 2011). The Si stiffeners were designed with tolerances of 6 µm to accommodate the alignment inaccuracy of the LED assembly on the PI substrates and dimensional variations of the LEDs.…”

Section: Silicon Stiffening Structuresmentioning

confidence: 99%

Hybrid intracerebral probe with integrated bare LED chips for optogenetic studies

Ayub

Gentet

Fiáth

et al. 2017

Biomed Microdevices

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This article reports on the development, i.e., the design, fabrication, and validation of an implantable optical neural probes designed for in vivo experiments relying on optogenetics. The probes comprise an array of ten bare light-emitting diode (LED) chips emitting at a wavelength of 460 nm and integrated along a flexible polyimidebased substrate stiffened using a micromachined ladder-like silicon structure. The resulting mechanical stiffness of the slender, 250-μm-wide, 65-μm-thick, and 5-and 8-mm-long probe shank facilitates its implantation into neural tissue.

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“…Well-established fabrication procedures are used to realize the 50-µm-thick single-sided electrode combs with iridium oxide (IrO x ) electrodes 35 µm in diameter [10] and the 30-mm-long flexible PI ribbon cables [7].…”

Section: System Componentsmentioning

confidence: 99%

Novel technology for the in-plane to out-of-plane transfer of multiple interconnection lines in 3D neural probes

Barz

Holzhammer

Oliver

et al. 2013

2013 Transducers &Amp; Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems

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This paper reports a novel process to accomplish the transfer of interconnection lines from the out-of-plane direction of probe combs into the plane of a common horizontal platform in compact three-dimensional (3D) silicon-based neural probe arrays. The central process step of the system assembly takes advantage of gold electroplating of micrometer-sized contact structures to form transfer contacts between the platform and multiple probe combs. In comparison with similar approaches reported in literature, the new process accommodates larger fabrication tolerances and achieves lower contact resistances.The processing of 64-channel probes with 50-µm-thick electrode combs was carried out in a batch process with a small variation of only 8% in the electroplated layer thickness of the transfer contacts. The electrical resistance of the transfer contacts is 336±18 mΩ. Electrode impedances were found to be between 140 and 320 kΩ at 1 kHz for iridium oxide coated electrodes 35 µm in diameter. KEYWORDSOut-of-plane assembly, electroplating, 3D neural probe, out-of-plane probe array, microelectrode

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Ultrathin Silicon Chips of Arbitrary Shape by Etching Before Grinding

Cited by 71 publications

References 16 publications

Application of floating silicon-based linear multielectrode arrays for acute recording of single neuron activity in awake behaving monkeys

Application of floating silicon-based linear multielectrode arrays for acute recording of single neuron activity in awake behaving monkeys

Hybrid intracerebral probe with integrated bare LED chips for optogenetic studies

Novel technology for the in-plane to out-of-plane transfer of multiple interconnection lines in 3D neural probes

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