Uncertainty contribution of tip-sample angle to AFM lateral measurements

González-Jorge, H.; Fernández-López, M.A.; Valencia, J. L.; Torres, S.

doi:10.1016/j.precisioneng.2010.08.001

Cited by 5 publications

(4 citation statements)

References 16 publications

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“…There are also errors in tests of topography image and force-distance curves. However, these errors from measurement system could be eliminated or reduced [9][10][11]and do not affect the results analysis because all of these effects from errors are in the same direction.…”

Section: Discussionmentioning

confidence: 99%

Comparison between Microcosmic Characterizations of Propellants by SEM and AFM

Yang

Liao

2012

AMR

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Section: Discussionmentioning

confidence: 99%

Comparison between Microcosmic Characterizations of Propellants by SEM and AFM

Yang

Liao

2012

AMR

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“…In addition, image reconstruction is time consuming as well as image stitching and registration between images can cause errors [125,126]. In case of the tilted sample, axis misalignment with the measurement frame can cause errors [127,128]. Fu et al simulated Si(1 1 1) atomic steps to estimate the errors due to the sample axis misalignment with respect to the measuring frame.…”

Section: Tilting-atomic Force Microscope (Tilting-afm)mentioning

confidence: 99%

Advances in the atomic force microscopy for critical dimension metrology

Hussain

Ahmad

Song

2016

Meas. Sci. Technol.

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Downscaling, miniaturization and 3D staking of the micro/nano devices are burgeoning phenomena in the semiconductor industry which have posed sophisticated challenges in the critical dimension (CD) metrology. Over the past few years, atomic force microscopy (AFM) has emerged as an important CD metrology technique in meeting these challenges because of its high accuracy, 3D imaging capability, high spatial resolution and non-destructive nature. In this article, advances in the AFM based critical dimension (CD) metrology are systematically reviewed and discussed. CD metrology AFM techniques, strengths, limitations and scanning algorithms are described. Developments towards accurate measurements such as creep and hysteresis compensation of the piezoelectric scanners, their calibration and tip characterization are discussed. In addition, image reconstruction and measures for achieving high accuracy CD measurements with hybrid metrology technique are also discussed. CD metrology challenges offered by the next generation lithography (NGL) techniques such as those associated with the 3D nanodevices of 10 nm node and beyond have been highlighted.

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“…The second one determines the random errors. Recent research works involving the uncertainty resulting from measurement operations and their estimation in both contact and non-contact measurement methods have been carried out [121][122][123][124][125]. In CMM, Marsh et al [121] compared the multistep method with the Donaldson reversal method to test the ability of the methods to separate errors at the nanometer level.…”

Section: Uncertaintymentioning

confidence: 99%

“…In spite of the information given by the previous studies of AFM tip-sample interactions, some problems are still unresolved in evaluating the uncertainty. An algorithm for the evaluation of the error and uncertainty contribution has been tested and developed with experimental results obtained from four step heights [125]. The application of the algorithm in this study is given for an aluminum rolling machine used in imprint lithography.…”

Section: Uncertaintymentioning

confidence: 99%

Advanced Nanomeasuring Techniques for Surface Characterization

Ali

2012

ISRN Optics

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Advanced precise and accurate nanomeasurement techniques play an important role to improve the function and quality of surface characterization. There are two basic approaches, the hard measuring techniques and the soft computing measuring techniques. The advanced soft measuring techniques include coordinate measuring machines, roundness testing facilities, surface roughness, interferometric methods, confocal optical microscopy, scanning probe microscopy, and computed tomography at the level of nanometer scale. On the other hand, a new technical committee in ISO is established to address characterization issues posed by the areal surface texture and measurement methods. This paper reviews the major advanced soft metrology techniques obtained by optical, tactile, and other means using instruments, classification schemes of them, and their applications in the engineering surfaces. Furthermore, future trends under development in this area are presented and discussed to display proposed solutions for the important issues that need to be addressed scientifically.

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Uncertainty contribution of tip-sample angle to AFM lateral measurements

Cited by 5 publications

References 16 publications

Comparison between Microcosmic Characterizations of Propellants by SEM and AFM

Comparison between Microcosmic Characterizations of Propellants by SEM and AFM

Advances in the atomic force microscopy for critical dimension metrology

Advanced Nanomeasuring Techniques for Surface Characterization

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