This letter describes the implementation of a low-cost 32 × 32 uncooled infrared microbolometer array using a standard 0.5-µm CMOS process and a surface sacrificial layer technique, in which the CMOS metal interconnection layers are used as the infrared sensitive material. The sacrificial layer embedded during the CMOS fabrication can be etched using a simple wet etching process following the CMOS processes, without the need for any lithography or material deposition steps. The CMOS metal interconnect layers are aluminum, with a temperature coefficient of resistance of 0.398%/K. The 32 × 32 focal plane array (FPA) has a pixel size of 65 µm × 65 µm and a fill factor of 29%. The thermal conductance of the FPA was measured to be 3.47 × 10 −6 W/K, with a thermal time of 3.85 ms, and a dc responsivity of 1050 V/W at a 10-Hz chopper frequency. The total measured rms noise of the microbolometer is 0.706 µV for a 10-kHz bandwidth, resulting in a detectivity of 5.2 × 10 8 cmHz 1/2 /W.