Underfill adhesive materials for flip chip applications

Tong, Q.K.

doi:10.1533/9780857092892.1.137

Cited by 7 publications

(3 citation statements)

References 5 publications

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“…For good mechanical and thermal shock resistance, the underfill adhesive needs to exhibit a stable storage modulus in the service temperature and T-cycle test High-Performance Reworkable Underfill Adhesives Based on Dicyclopentadiene Epoxy Thermoset DOI: http://dx.doi.org/10.5772/intechopen.107334 temperature range (−40 to 85°C). Since underfill adhesives distribute stress along the bondline rather than at the point of contact between the die and solder ball, the mechanical reliability improvement by their use has been well established (1,2). Higher Tg and modulus in the adhesive further improve the mechanical reliability due to lower CTE mismatch below the Tg of the cured adhesive.…”

Section: Development Of Underfill Formulationsmentioning

confidence: 99%

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High-Performance Reworkable Underfill Adhesives Based on Dicyclopentadiene Epoxy Thermoset

Sridhar¹,

Champagne²

2023

Next Generation Fiber-Reinforced Composites - New Insights

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A highly reliable and reworkable underfill adhesive based on thermoset epoxy resin possessing thermally reversible dicyclopentadiene (DCPD) moiety is described. The adhesive can be cured rapidly at moderate temperatures resulting in high Tg cured network, which gives high reliability to the bonded semiconductor components. The inherent thermal reversibility of DCPD moiety causes network breakdown at high temperatures enabling easy removal of defective semiconductor chips. A discernible trend between loading level of the thermally reversible epoxy resin and high-temperature die shear strength was observed. Using this novel adhesive system, both high reliability and reworkability can be achieved concurrently, which is normally not possible with other thermoset adhesive systems. The epoxy resin used in the study was scaled up to multi-kg quantities demonstrating industrial applicability of the approach.

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Section: Development Of Underfill Formulationsmentioning

confidence: 99%

“…Underfill adhesives are widely used to improve the overall thermal shock resistance, mechanical and electrical reliability of the assembly [2]. After a chip is mounted on a circuit board, the space between the chip and the PCB is filled with an underfill adhesive resin.…”

Section: Introductionmentioning

confidence: 99%

High-Performance Reworkable Underfill Adhesives Based on Dicyclopentadiene Epoxy Thermoset

Sridhar¹,

Champagne²

2023

Next Generation Fiber-Reinforced Composites - New Insights

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“…Finally the underfill is solidified in a curing step to bring the total to 6 process steps for flip chip assembly. To increase throughput of the device assembly process it would be advantageous to combine the flux and underfill materials into one single material enabling three steps; fluxing, underfilling and cure to occur during the reflow processing step thus eliminating the defluxing and capillary underfill steps [3]. Materials that accomplish this are referred to here as One Step Chip Attach or OSCA materials.…”

Section: Introductionmentioning

confidence: 99%

Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Curing Kinetics and Solder Reflow Aspects

Duffy¹,

Bhavsar²,

Lin³

et al. 2015

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)

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One step chip attach materials (OSCA) are dispensable polymeric materials for flip chip assembly, which are designed to flux metallic interconnections and subsequently turn into an underfill upon curing. OSCA materials enable a drastic simplification of the assembly process by combining the reflow, flux residue cleaning and capillary underfilling steps used in traditional die attach processing into a single step. A key challenge when designing OSCA materials for conventional mass reflow processing (identified as OSCA-R) is timing the cure kinetics with the fluxing and soldering sequences during reflow processing. OSCA-R materials must also have a process-friendly rheological design that integrates seamlessly with standard dispensing equipment and enables the filler loading levels required for customized thermal conductivities. The consideration of the interactions between the filler particles and the organic portion of OSCA materials is critical for first achieving fluxing and interconnection during reflow and second curing the material to develop target thermo mechanical properties for reliability such as Tg, TC, CTE modulus and adhesion after reflow. This paper presents research focused on understanding the impact of filler loading, size, type and surface chemistry on curing, fluxing and interconnection kinetics during reflow processing measured by thermal and rheological methods. Preliminary results indicate the presence of chemical interactions between the filler and organic formulations, as well as complex physical interactions which need to be considered in the design of OSCA-R materials for a device assembly using conventional mass reflow processing.

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Novel underfill material with low coefficient of thermal expansione

Zhang

Zhu

et al. 2016

2016 17th International Conference on Electronic Packaging Technology (ICEPT)

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Underfill adhesive materials for flip chip applications

Cited by 7 publications

References 5 publications

High-Performance Reworkable Underfill Adhesives Based on Dicyclopentadiene Epoxy Thermoset

High-Performance Reworkable Underfill Adhesives Based on Dicyclopentadiene Epoxy Thermoset

Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Curing Kinetics and Solder Reflow Aspects

Novel underfill material with low coefficient of thermal expansione

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