Understanding and optimizing delamination/recycling of printed circuit boards using a supercritical carbon dioxide process

Waste Printed Circuit Boards recycling: an extensive assessment of current status

“…The adhesive layer of epoxy resin in PCBs can be destroyed by supercritical CO 2 to liberate different materials layers and to recover phosphate-based flame retardants Triphenyl phosphate (TPPO 4 ) efficiently at 343 K and 25 MPa (Wang and Zhang, 2012). A similar study (Sanyal et al, 2013) indicates that supercritical CO 2 and an additional amount of water can be very useful in de-lamination of PCB substrate and further separation of copper foils, glass fibers and polymers.…”

A review on the recycling of waste carbon fibre/glass fibre-reinforced composites: fibre recovery, properties and life-cycle analysis

“…A final wash to the recycled GF with organic solvents is required to improve the feasibility of the process [139], as well as to increase the delaminating mechanism in recycling WPCBs to allow for GF recycling. A minor per cent (7 vol%) of water below its critical point can result in higher resin decomposition efficiency [140].…”

Comparative study of printed circuit board recycling by cracking of internal layers using organic solvents-dimethylformamide and dimethylacetamide

“…Further, only 75e80% yield of metal liberation is practically achievable (Sanyal et al, 2013) and hence, full recovery of metal values is extremely difficult.…”