Understanding of highly-oriented 3C-SiC ductile-brittle transition mechanism in ELID ultra-precision grinding

Yang, Meijun; Liu, Cong; Guo, Bingjian; Liu, Kai; Tu, Rong; Ohmori, Hitoshi; Zhang, Song

doi:10.1016/j.matchar.2023.113136

Cited by 6 publications

(2 citation statements)

References 45 publications

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“…Shamray et al [23] investigated the ductile-to-brittle transition behaviors of Si 3 N 4 ceramics, and a Si 3 N 4 substrate with a ductile surface and subsurface was obtained by controlling the maximum undeformed chip thickness. Yang et al [24] investigated the ductile removal phenomenon of 3C-SiC involved in precision grinding process. Electrolytic in-process dressing was found to facilitate the generation of a compressive residual stress, enabling ductile removal of 3C-SiC.…”

Section: Introductionmentioning

confidence: 99%

Damage evolution and removal behaviors of GaN crystals involved in double-grits grinding

Li,

Hu,

Wei

et al. 2024

Int. J. Extrem. Manuf.

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Understanding the complex interactions between the work material and abrasives is a difficult and hot topic during grinding of Gallium nitride (GaN) single crystals. In this work, molecular dynamics (MD) simulations of double-grits interacted grinding of GaN crystals were performed, and the grinding force, coefficient of friction, stress distribution, plastic damage behaviors, and abrasive damage were systematically investigated. The results demonstrated that interacted distance with both radial and transverse directions achieved better grinding quality than that with only one direction or single-grit grinding. The grinding force, grinding induced stress, subsurface damage depth, and abrasive wear increases as the transverse interacted distance increases. However, the influence laws of the interacted distance on atom number of phase transition and dislocation length are not distinct. Appropriate interacted distances between abrasives can decrease grinding force, coefficient of friction, grinding induced stress, subsurface damage depth, and abrasive wear during the grinding process. Grinding test combined with the cross-sectional TEM detection verified the reliability of the simulated damage behaviors, i.e. amorphous, high-pressure phase transition, dislocations, stacking faults, and lattice distortions. The results not only enhance the understanding of damage accumulation and material removal caused by the coupling actions of abrasives in grinding process, but also provide a feasible approach for the wheel design of ordered abrasives.

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Section: Introductionmentioning

confidence: 99%

Damage evolution and removal behaviors of GaN crystals involved in double-grits grinding

Li,

Hu,

Wei

et al. 2024

Int. J. Extrem. Manuf.

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“…As early as the 1980s, cast-iron-bonded grinding diamond wheels with micro-scaled powders were innovatively fabricated by T. Nakagawa [1][2][3]. However, due to their small pores, which were easily blocked and caused passivation, these fine-grain, cast-ironbonded grinding diamond wheels proved difficult to popularize and apply in common grinding processes of that era [4][5][6][7]. To address the issue of abrasive passivation, significant progress has been made in achieving nano-level surface quality by applying the ELID grinding method to sharpen the abrasives (H.Ohmori).…”

Section: Introductionmentioning

confidence: 99%

ELID Dressing Behaviors of Non-Abrasive Iron-Based Grinding Wheels

Zhang,

Kuai

et al. 2023

Applied Sciences

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Non-abrasive iron-based grinding diamond wheels, lacking abrasive particles, negate the concern of detached passivated abrasives scratching the polished surface. During the Electrolytic In-Process Dressing (ELID) polishing process, α-Fe2O3 particles form on the oxide film surface of the iron-based grinding diamond wheel devoid of abrasives. These particles assume the role of the grinding diamond wheel for polishing. Therefore, the ELID electrolytic performance and the oxide film formation performance of the non-abrasive iron-based grinding diamond wheel significantly influence the formation of α-Fe2O3 particles and the subsequent ELID polishing performance. Our studies investigating the ELID dressing behavior of the non-abrasive iron-based grinding diamond wheel have analyzed the influence mechanism of the electric field, flow field, and pulse energy on its ELID dressing. Moreover, the roundness of the ELID dressing grinding diamond wheel, oxide film properties, and α-Fe2O3 particle content were measured, and plate glass was polished using the ELID non-abrasive iron-based grinding diamond wheel. The results illustrate that the non-abrasive iron-based grinding diamond wheel exhibits excellent ELID dressing performance. The diamond wheel’s roundness is less than 0.001 mm, the oxide film uniformly covers the surface, the content of α-Fe2O3 particles is evenly distributed, and the surface accuracy of the polished plate glass is approximately 0.5 nm. These findings provide a compelling case for the continued use and development of grainless iron-based grinding diamond wheels in precision grinding operations.

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Brittle-ductile transition mechanism during grinding 4H-SiC wafer considering laminated structure

Qu,

Huang,

Huang

et al. 2024

International Journal of Mechanical Sciences

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Understanding of highly-oriented 3C-SiC ductile-brittle transition mechanism in ELID ultra-precision grinding

Cited by 6 publications

References 45 publications

Damage evolution and removal behaviors of GaN crystals involved in double-grits grinding

Damage evolution and removal behaviors of GaN crystals involved in double-grits grinding

ELID Dressing Behaviors of Non-Abrasive Iron-Based Grinding Wheels

Brittle-ductile transition mechanism during grinding 4H-SiC wafer considering laminated structure

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