Deposition of CuNPs on silver film gives rise to the
formation
of active Ag–Cu interfaces leading to dramatic enhancements
in antibacterial activity against Escherichia coli. Transmission electron microscopy (TEM) and energy-dispersive X-ray
spectroscopy (EDAX) analyses reveal that CuNPs are covered in a thin
Cu2O shell, while X-ray photoelectron spectroscopy measurements
(XPS) reveal that the Ag film samples contain significant amounts
of Ag2O. XPS analyses show that the deposition of CuNPs
on Ag films leads to the formation of a photoactive Ag2O–Cu2O heterostructure. Following a Z-scheme mechanism, electrons from the conduction band of Ag2O recombine with photogenerated holes from the valence band of Cu2O. Consequently, electrons at Cu2O’s conduction
band render Cu reduced and cause reductive activation of surface oxygen
species on Cu forming reactive oxygen species (ROS). Interaction between
metallic Cu and ROS species leads to the formation of a Cu(OH)2 phase. Both ROS and Cu(OH)2 species have previously
been reported to lead to enhanced antibacterial properties. Holes
on Ag2O produce a highly oxidized AgO phase, a phase reported
to exhibit excellent antibacterial properties. Quantitative analysis
of Cu and Ag high-resolution X-ray photoelectron spectroscopy (HR-XPS)
spectra directly reveals several-fold increases in these active phases
in full agreement with the observed increase in antibacterial activities.
This study provides insight and surface design parameters by elucidating
the important roles of Ag and Cu’s bifunctionality as active
antibacterial materials.