2017
DOI: 10.1016/j.compositesb.2016.10.030
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Understanding the effect of temperature on the interfacial behavior of CFRP-wood composite via molecular dynamics simulations

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Cited by 71 publications
(24 citation statements)
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“…For the nonbonded interaction, the two parameters ε and σ are determined by matching the experimentally measured density and Young's modulus of the PP bulk system, as described in detail in the Supporting Information. This yields values of ε = 2.00 kcal·mol −1 and σ = 0.72 nm, which also lie in the range of reported values (i.e., ε = 0.5–4.0 kcal·mol −1 and σ = 0.55–0.89 nm) for the CG modeling of polymers . All the functional forms and parameters of CG force field are summarized in Table .…”
Section: Methodssupporting
confidence: 66%
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“…For the nonbonded interaction, the two parameters ε and σ are determined by matching the experimentally measured density and Young's modulus of the PP bulk system, as described in detail in the Supporting Information. This yields values of ε = 2.00 kcal·mol −1 and σ = 0.72 nm, which also lie in the range of reported values (i.e., ε = 0.5–4.0 kcal·mol −1 and σ = 0.55–0.89 nm) for the CG modeling of polymers . All the functional forms and parameters of CG force field are summarized in Table .…”
Section: Methodssupporting
confidence: 66%
“…Finally, another 10 ns equilibration is carried out under the isothermal‐isobaric (NPT) ensemble, where the number of particles, pressure, and temperature of the system are controlled. The temperature, pressure, and volume of the polymer system gradually converge to the respective values at the end of the equilibration process, which indicates that a thermodynamically stable system has been reached after the equilibration . Meanwhile, by measuring the average end‐to‐end distance of the polymer chains in the PP system during equilibration, it is demonstrated that the polymer chains have been relaxed properly, as shown in the Supporting Information.…”
Section: Methodsmentioning
confidence: 79%
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“…[5,6] For example, the intrinsic residual stress in the Cu film is just around hundreds of megapascals, whereas that in the Ti film is more than one gigapascal. [12][13][14][15] The acquired view of dynamic evolution in systems provides an access to figure out the intrinsic residual stress relationship with film nanostructures. [8,9] Although experimental methods have been used to analyze this stress, the lack of an approach enabling an in situ capture of the atom configuration evolution at the interface impedes further investigation on the intrinsic residual stress.…”
Section: Introductionmentioning
confidence: 99%