Understanding the Impact of PCB Changes in the Latest Published JEDEC Board Level Drop Test Method

Thukral, Varun; Zaal, J.J.M.; Roucou, R.; Jalink, J.; Rongen, R.T.H.

doi:10.1109/ectc.2018.00117

Cited by 8 publications

(2 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Similar results are observed by Thukral et al [31] during board level drop testing [30]. In addition, the peak-peak displacement of the JESD-B111A is lower than the JESD-B111 type board design.…”

Section: Test Board Designssupporting

confidence: 88%

Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges

Thukral

Soestbergen²,

Zaal³

et al. 2022

Microelectronics Reliability

View full text Add to dashboard Cite

Section: Test Board Designssupporting

confidence: 88%

Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges

Thukral

Soestbergen²,

Zaal³

et al. 2022

Microelectronics Reliability

View full text Add to dashboard Cite

“…Generally, the components located in the middle of this test board (referred as Group A) receive the maximum amount of stress as compared to the remaining devices under test (referred as Group B) [2][10]. It is also established in the temperature coupled vibration test reliability assessment.No failures are observed in Group B & C after 2051 minutes.…”

mentioning

confidence: 99%

Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications

Thukral,

Bacquet,

Van Soestbergen

et al. 2023

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

Self Cite

View full text Add to dashboard Cite

Board level vibration testing is a commonly used method to predict the solder joint reliability of surface-mounted components seated onto printed circuit boards (PCB). Current board level vibration test methods are mainly developed from a solely mechanical stress application standpoint. This makes such stress tests one dimensional in nature and translation from experimentally obtained test results to the field life of components experiencing combined stress environments become ambiguous. This investigation provides insights to develop a highly accelerated vibration test approach to cover simultaneous vibration and temperature loading situations in the field. In this paper, test board layouts from the board level drop test method, JESD22-B111 (rectangular PCB), and JESD22-B111A (square PCB), prescribed by the Joint Electronic Device Engineering Council (JEDEC), are used to understand the combined stress applied to the solder interconnects. The evaluation process is carried out by means of simulations, supported by targeted experiments on ball grid array (BGA) packages with dimensions sizing from 12x12mm to 15x15mm. The results on rectangular test board assembly show reduced characteristic lifetime of solder joints when stressed under combined temperature-vibration test conditions. On the other hand, the square-shaped board type exhibits a different acceleration factor with a longer solder fatigue lifetime than that of the rectangular-shaped PCB type. Finite element simulation results complement well with this finding.

show abstract

Lead (Pb)‐Free Solders for High Reliability and High‐Performance Applications

Coyle

2020

Lead‐free Soldering Process Development and Reliability

View full text Add to dashboard Cite

Understanding the Impact of PCB Changes in the Latest Published JEDEC Board Level Drop Test Method

Cited by 8 publications

References 9 publications

Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges

Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges

Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications

Lead (Pb)‐Free Solders for High Reliability and High‐Performance Applications

Contact Info

Product

Resources

About