Understanding the role of encapsulation layers under wet conditions on the reliability of power devices

Reggiani, Susanna; Balestra, Luigi; Gnani, Elena; Rossetti, Mattia; Depetro, Riccardo

doi:10.1109/edtm58488.2024.10511803

2024 8th IEEE Electron Devices Technology &Amp;amp; Manufacturing Conference (EDTM) 2024

DOI: 10.1109/edtm58488.2024.10511803

|View full text |Cite

Understanding the role of encapsulation layers under wet conditions on the reliability of power devices

Susanna Reggiani,

Luigi Balestra,

Elena Gnani

et al.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2024

Publication Types

Select...

Other1

Relationship

Self Cite0

Independent1

Authors

Journals

Cited by 1 publication

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

Characterization and TCAD Simulation of the Electrostatic Potential Distortion in HV-ICs due to Losses in the Epoxy Mold Compound

Balestra,

Gnani,

Reggiani

et al. 2024

2024 IEEE Latin American Electron Devices Conference (LAEDC)

View full text Add to dashboard Cite

Characterization and TCAD Simulation of the Electrostatic Potential Distortion in HV-ICs due to Losses in the Epoxy Mold Compound

Balestra,

Gnani,

Reggiani

et al. 2024

2024 IEEE Latin American Electron Devices Conference (LAEDC)

View full text Add to dashboard Cite

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Understanding the role of encapsulation layers under wet conditions on the reliability of power devices

Cited by 1 publication

References 8 publications

Characterization and TCAD Simulation of the Electrostatic Potential Distortion in HV-ICs due to Losses in the Epoxy Mold Compound

Characterization and TCAD Simulation of the Electrostatic Potential Distortion in HV-ICs due to Losses in the Epoxy Mold Compound

Contact Info

Product

Resources

About