Unipolar and bipolar pulsed current electrodeposition for PCB production

Towards electroformed nanostructured aluminum alloys with high strength and ductility

“…This observation provides a motivation for the introduction of PC into the deposition process because it can significantly affect the kinetic processes on the electrode and thereby affect nanostructure formation. For example, in other alloy systems (generally using aqueous baths), waveforms with "off-time" have been found to affect aspects of the deposits such as chemical composition 32,[49][50][51] and homogeneity, 49 surface roughness, 49,52,53 grain size distribution, 47,51,52,54,55 and texture. 50 Reverse pulse waveforms have also been found to significantly affect such coating attributes.…”

“…50 Reverse pulse waveforms have also been found to significantly affect such coating attributes. 23,52,[56][57][58][59] In the case of alloy coatings in particular, periodic anodic pulses can be used to selectively remove the element with the highest oxidation potential, thus allowing an additional degree of control over the alloy composition.…”

Pulse plated cadmium telluride films and their characteristics

“…In contrast to the direct current electrodeposition where only current or voltage can be controlled, in pulse current electrodeposition, ON time, OFF time and peak current density can be independently varied. This can be judiciously employed to create a mass transport situation and promote electro-crystallization of the film through adsorption and desorption effects [20][21][22] which determine the crystalline, compositional and optical properties of the film. In this work, the CdTe films were deposited at duty cycles higher than 10% and in the range 10-50%.…”

Properties and mechanism of solar absorber CdTe thin film synthesis by unipolar galvanic pulsed electrodeposition

“…The pulsed current electrodeposited CdTe films are also more uniform compared to the DC deposited films. Film uniformity depends on the distribution of current across the substrate surface, conductivity of the electrolyte and the electrodeposition kinetics and could be described in terms of the uniformity quotient U Q which takes into account all these factors [23],…”