2018
DOI: 10.1038/s41467-018-04942-x
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Unmasking chloride attack on the passive film of metals

Abstract: Nanometer-thick passive films on metals usually impart remarkable resistance to general corrosion but are susceptible to localized attack in certain aggressive media, leading to material failure with pronounced adverse economic and safety consequences. Over the past decades, several classic theories have been proposed and accepted, based on hypotheses and theoretical models, and oftentimes, not sufficiently nor directly corroborated by experimental evidence. Here we show experimental results on the structure o… Show more

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Cited by 322 publications
(136 citation statements)
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“…The rupture of the passivation film is caused by the interaction between Cl − ions and the passivation film, and the reaction process is shown in the following equations: Al(OH)3+ClAltrue(OHtrue)2Cl+OH, Al(OH)2Cl+ClAltrue(OHtrue)Cl2+OH, Altrue(OHtrue)Cl2+ClAlCl3+OH.…”
Section: Resultsmentioning
confidence: 99%
“…The rupture of the passivation film is caused by the interaction between Cl − ions and the passivation film, and the reaction process is shown in the following equations: Al(OH)3+ClAltrue(OHtrue)2Cl+OH, Al(OH)2Cl+ClAltrue(OHtrue)Cl2+OH, Altrue(OHtrue)Cl2+ClAlCl3+OH.…”
Section: Resultsmentioning
confidence: 99%
“…The possible reasons were the continuous deposition of Cu onto the stainless steel surface to create a barrier for further electrochemical corrosion in wet conditions . However, it has also been reported that chloride ions in the electrolyte can penetrate the surface passive layer, accumulate on the interface between metal and passive film and cause the passivity breakdown, or initiate a break‐down at defective sites such as grain boundaries and nonmetallic inclusion (e.g., MnS) . In the current case of Cu‐bearing steel, chloride ions from the electrolyte may form unstable copper chloride complexes with Cu on the interface of metal substrate and passive film, acting as vulnerable points for the pitting corrosion .…”
Section: Discussionmentioning
confidence: 99%
“…Furthermore, the noble second phase fall down to form pits when the matrix is dissolved around them for SB ( figure 12(a3), based on figures 6∼7) [45]. As for SF, the corrosion product layer become thicker too bu t the interfaces (in the composite film itself and between film and matrix) would retard the crack propagating in layer ( figure 12(b3), based on figures 6∼7) [44,50]. Finally, the aggressive Cl − would assemble in the cracks and pits more serious, which would result further severe pitting corrosion.…”
Section: Discussionmentioning
confidence: 99%