Unsteady Heat Transfer and Pressure Drop in Channels with Obtacles Mounted on the Upper and Lower Walls

Effect of Net Geometry on the Nusselt Number Distribution for Channel Flow

“…Reference [38] plots Eq. (14) and shows that when as many as 14 longitudinal ribs are introduced, the equivalent diameter becomes 25% less than its value for no-ribs case. Thus, it becomes important that an appropriate equivalent diameter be used in calculating the Nusselt number distributions in Eq.…”

“…Their study focused on the effect of insertion of a porous matrix between the blocks on the Nusselt number distribution. Unlike the previous studies which dealt with steady-state conditions, Korichi et al [14] investigated the unsteady conjugate heat transfer between the channel and obstacles mounted on the upper and lower walls under turbulent flow conditions. They calculated the heat transfer coefficients by accounting for the conduction heat transfer mode in solid phase.…”

Heat transfer enhancement in self-sustained oscillatory flow in a grooved channel with oblique plates

“…Finally and in order to take in account the conjugate heat transfer, the treatment of the sudden changes of the thermophysical properties at the solid-fluid interface is handled by applying the domain extension method the details of which are presented in [29]. The code was already validated and used in previous works [30][31][32][33]. It is important to note that 300,000 time steps are needed to obtain fully developed time periodic flow at Re = 1000 which takes about 210 hours for Ds = 2 Â 10 À5 , on a PC with P4 processor.…”

An Investigation of Convective Cooling of an Array of Channel-Mounted Obstacles

“…The flow passing over the multiple obstacles presents several complexities such as impingement, cavity vortices, and recirculation zone reattachment [4][5][6][7]. The convective heat transfer from the surfaces of these obstacles varies substantially with the geometrical configurations of the chips.…”

“…In most of these investigations, the problem is idealized to the fluid flow and thermal analysis of heat generating obstacles, representing the electronic devices, within a channel [1][2][3][4][5][6][7][8][9][10][11][12][13][14]. This description of the problem provides a pathway for obtaining pertinent results.…”