Unusual example of induced codeposition of tungsten. Galvanic formation of Cu–W alloy

Bącal, Paweł; Indyka, Paulina; Stojek, Zbigniew; Donten, Mikołaj

doi:10.1016/j.elecom.2015.02.016

Cited by 23 publications

(12 citation statements)

References 22 publications

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“…It can be concluded from the analysis of the diffractograms in Fig. 8 that the copper nanocrystals are of size circa 100 nm (in orientation 111) and 30-40 nm (in orientation 100) which was suggested already in [14].…”

Section: Resultsmentioning

confidence: 99%

“…These alloys can be electrodeposited from citrate baths which are known for their low toxicity and long-time usage. In our previous work, we presented a way of successful codeposition of tungsten with copper, a metal that does not belong to the iron group [14]. The mechanism of deposition of that material may differ from those postulated for the FeW, NiW, and CoW systems because tungsten and copper do not form thermodynamically stabile homogenous binary phases [15].…”

Section: Introductionmentioning

confidence: 99%

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Optimization of CuW alloy electrodeposition towards high-tungsten content

Bącal

Stojek

Donten

2016

J Solid State Electrochem

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With the help of the factorial design of experiments, optimization of the deposition of the CuW alloy was successfully done. The important deposition parameters were identified as pH, current density, and-the most important onecopper ion concentration. All of them were examined in their wide ranges. Under optimal conditions, in a citrate bath, with copper ion concentration of 1.0 mM, at current density of −100 mA cm −2 and at pH ca. 8.3, the alloy layer had the highest tungsten content (circa 30 wt.%), satisfactory adhesion and a smooth and crackless morphology. The structure of the electrodeposited alloy can be described as an amorphous solid solution of Cu in W with built-in Cu nanocrystals.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Optimization of CuW alloy electrodeposition towards high-tungsten content

Bącal

Stojek

Donten

2016

J Solid State Electrochem

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“…Investigations have shown that one of the challenges with W is to obtain pure W coatings through electrodeposition method [12,13]. Therefore, to address this issue, researchers have explored co-deposition method, where W is deposited along with other metals like Ni, Co, Cu and Fe [14][15][16].…”

Section: Introductionmentioning

confidence: 99%

Chronopotentiometry driven electrodeposition of Cu- Ni-W thin films on ITO substrate: A comprehensive study of microstructure and corrosion behaviour

Saini,

Singh,

Khatri

2024

Preprint

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Cu-Ni-W thin films are deposited by varying the current density from − 5 to -60 mA/cm² using the galvanostatic chronopotentiogram method on ITO-coated glass substrates. The X-ray diffraction (XRD) analysis revealed that Cu-Ni-W thin films exhibit a face-centered cubic structure with the presence of specific crystallographic planes, particularly (111), (200), and (220), at 2θ values of 43.4°, 50.7°, and 74.7°. The additional peaks observed at other 2θ values correspond to NiW and Ni4W phases. It is found that film deposited at higher current densities favor the growth of smaller crystalline size of 17 nm and higher degree of texture coefficient of 2.48. The maximum value of micro-strain of about 16% is calculated from the peak broadening of X-ray diffractograms. Due to the strong (111) texture and nano crystallites as confirmed by XRD resulted in an outstanding corrosion resistance of 16.22 kΩ cm² for the film deposited at -60 mA/cm².

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“…3,4 Butynediol (2-Butyne-1,4-diol, BD) is a commonly used organic additive in the electroplating industry due to its brightening/leveling effects. [5][6][7] During electrodeposition, simultaneous processes such as adsorption/desorption of organic additives and hydrogen evolution reaction (HER) result in the growth of unusual micro-/nanostructures. 6 The inevitable HER that occurs through the formation of adsorbed hydrogen as an intermediate reduces the Faradaic efficiency.…”

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confidence: 99%

Butynediol’s Role beyond Brightening Additive during Electrodeposition of Cobalt

Muniyandi¹,

Lakshminarasimhan²,

Jeyabharathi³

2022

J. Electrochem. Soc.

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Butynediol (2-Butyne-1,4-diol), a well-known type-II brightening additive, changes the interfacial pH resulting in the formation of porous cobalt hydroxide film of ca. 1 µm thickness over the copper substrate in a short duration of electrodeposition (2 min.) and at a very low current density (−5 mA/cm2) from sulfate bath. In the absence of butynediol, a metallic cobalt layer was observed under identical deposition conditions. The choice of anions (sulfates, chlorides and nitrates) in the electrodeposition bath determines the kind of electrodeposited films obtained, viz., cobalt, cobalt/cobalt hydroxide, and compact cobalt hydroxide. The adsorption of butynediol enhances hydrogen evolution due to water reduction that facilitates the formation of porous microstructures of cobalt hydroxide. Competition for adsorption sites between butynediol and chloride and dissolution of cobalt hydroxide by diffusing protons result in a mixed metallic cobalt particle and porous cobalt hydroxide microstructure. The variation in the phases and microstructures of electrodeposits was evidenced through the difference in the magnetic and electrocatalytic properties of the films.

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Unusual example of induced codeposition of tungsten. Galvanic formation of Cu–W alloy

Cited by 23 publications

References 22 publications

Optimization of CuW alloy electrodeposition towards high-tungsten content

Optimization of CuW alloy electrodeposition towards high-tungsten content

Chronopotentiometry driven electrodeposition of Cu- Ni-W thin films on ITO substrate: A comprehensive study of microstructure and corrosion behaviour

Butynediol’s Role beyond Brightening Additive during Electrodeposition of Cobalt

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