Unveiling thermal properties and pump-out blocking in diamond/GaInSn composites as thermal interface materials

Du, Shi-Jie; Guo, Hong; Xie, Zhong-Nan; Zhang, Jie; Huang, Shu-Hui; Wu, Nan; Mi, Xu-Jun; He, Xin-Bo; Yang, Hui; Liu, Yu-Lin

doi:10.1007/s12598-023-02331-y

Cited by 5 publications

(1 citation statement)

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“…The advantages of thermal shims and phase change materials are that they are easy to use, and their failure forms are mainly stress cracks. As paste thermal conductivity materials, diamond/GaInSn composites have the advantages of high thermal conductivity and high deformation; thus, they can be used in electronic packaging as high-performance TIMs [ 14 ]. Compared with the current commercial TIMs, namely, In and thermal grease, diamond/GaInSn composites have outstanding advantages and excellent properties, including high thermal conductivity, low interfacial thermal resistance, and high viscosity; however, their reliability is rarely studied [ 15 , 16 , 17 ].…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Property Evolution of Diamond/GaInSn Composites under Thermal Load and High Humidity

Du,

Guo,

Zhang

et al. 2024

Materials

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As a thermal interface material, diamond/GaInSn composites have wide-ranging application prospects in the thermal management of chips. However, studies on systematic reliability that can guide the practical application of diamond/GaInSn in the high-temperature, high-temperature impact, or high-humidity service environments that are faced by chips remain lacking. In this study, the performance evolution of diamond/GaInSn was studied under high-temperature storage (150 °C), high- and low-temperature cycling (−50 °C to 125 °C), and high temperature and high humidity (85 °C and 85% humidity). The experimental results reveal the failure mechanism of semi-solid composites during high temperature oxidation. It is revealed that core oxidation is the key to the degradation of liquid metal composites’ properties under high-temperature storage and high- and low-temperature cycling conditions. Under the conditions of high temperature and high humidity, the failure of Ga-based liquid metal and its composite materials is significant. Therefore, the material should avoid high-temperature and high-humidity environments.

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