2017
DOI: 10.1063/1.4978643
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Upscaling high-quality CVD graphene devices to 100 micron-scale and beyond

Abstract: We describe a method for transferring ultra large-scale CVD-grown graphene sheets. These samples can be fabricated as large as several cm 2 and are characterized by magneto-transport measurements on SiO 2 substrates. The process we have developed is highly effective and limits damage to the graphene all the way through metal liftoff, as shown in carrier mobility measurements and the observation of the quantum Hall effect. The charge-neutral point is shown to move drastically to near-zero gate voltage after a 2… Show more

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Cited by 22 publications
(11 citation statements)
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“…However, under real experimental conditions and in a macroscopic graphene sample with a spin imbalance n ↑ − n ↓ = 0, the problem becomes many-body and corrections to the g-factor emerge. the graphene that was synthesized by chemical vapor deposition is described by Lyon et al [35]. We employed low temperature (1.4K) resistively-detected electron-spin resonance (RD-ESR) [12,36,37], a spin-selective probing technique that couples carriers of opposite spin by microwave excitation, and detects the response resistively.…”
mentioning
confidence: 99%
“…However, under real experimental conditions and in a macroscopic graphene sample with a spin imbalance n ↑ − n ↓ = 0, the problem becomes many-body and corrections to the g-factor emerge. the graphene that was synthesized by chemical vapor deposition is described by Lyon et al [35]. We employed low temperature (1.4K) resistively-detected electron-spin resonance (RD-ESR) [12,36,37], a spin-selective probing technique that couples carriers of opposite spin by microwave excitation, and detects the response resistively.…”
mentioning
confidence: 99%
“…A 200 μm by 20 μm Hall bar structure was patterned by standard optical lithography, O 2 plasma etching and PVD of Au for the Ohmic contacts. A detailed description of the fabrication process can be found in [ 25 ]. The device was then transferred to a ceramic chip carrier and wire-bonded using a combination of ultrasonic wedge bonding (for the chip carrier pads) and conductive silver paint (for the graphene contacts).…”
Section: Methodsmentioning
confidence: 99%
“…The thickness of the dielectric layer is adjusted to the acoustic wave length and suppresses any leakage of the SAW into the bulk. CVD Monolayer graphene (MLG) is transferred to the substrate 22 and patterned into a Hall bar close to an IDT (sample details in the caption of Fig. 1).…”
mentioning
confidence: 99%