Use of Heat Transfer Enhancement Techniques in the Design of Heat Exchangers

Picón‐Núñez, Martín; Melo-González, Jorge C.; Castillo, Jorge Luis García

doi:10.5772/intechopen.78953

Cited by 4 publications

(3 citation statements)

References 25 publications

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“…Pada desain PFHE, header distribusi tidak diperlukan karena port-port penting sudah terintegrasi ke dalam desain pelat. Berbagai parameter geometri menggambarkan PFHE yang ditampilkan pada Gambar 1, termasuk jumlah pelat (N), jumlah lintasan (P), panjang pelat (L), lebar pelat (W), sudut chevron (β), jarak antarpelat (b), diameter lubang (Dp), tebal pelat (τ), dan faktor pembesaran (φ) [11]. ini membutuhkan lebih banyak energi pemanasan atau pendinginan karena temperatur fluida dingin yang keluar tidak bisa lebih tinggi dari temperatur fluida panas yang keluar.…”

Section: Pendahuluanunclassified

Pengaruh Kenaikan Laju Alir Fluida Panas dan Arah Aliran terhadap Kinerja Plate and Frame Heat Exchanger

Achmad,

Naldi,

Uzlifah Janah

et al. 2024

J. Teknik Kimia

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Plate and Frame Heat Exchanger (PFHE) is a plate and frame type heat exchanger that is efficient and effective in improving energy efficiency. Research using PFHE aims to determine the effect of increasing the flow rate of hot fluid on heat exchanger performance. This research was conducted at a flow rate variation of 0.7 L/min, 0.9 L/min, 1.1 L/min, 1.3 L/min, 1.5 L/min, 1.7 L/min, and 1.8 L/min with 180 seconds of testing each variation and recording data every 2 seconds. The cold fluid used is tap water and the hot fluid used is distilled water. The results showed that with the increase in hot fluid flow rate, the performance of PFHE also increased because the effectiveness of NTU (Ɛ-NTU) increased. The Ɛ-NTU value of unidirectional flow is 25.37% - 44.87% and in the opposite direction 37% - 68.39%. The largest Ɛ-NTU value in the countercurrent flow indicates that the countercurrent flow is more effective than the unidirectional flow. In addition, increasing the flow rate increases the Reynold's number (Nre) and Nusselt's number (Nu) which indicates the greatest convection heat transfer occurs at the highest flow rate.

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Section: Pendahuluanunclassified

Pengaruh Kenaikan Laju Alir Fluida Panas dan Arah Aliran terhadap Kinerja Plate and Frame Heat Exchanger

Achmad,

Naldi,

Uzlifah Janah

et al. 2024

J. Teknik Kimia

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“…While passive techniques don't rely on any source of power, active techniques use a variety of external powers to improve the performance of heat transfer, such as uid suction or injection, surface uid vibrations, etc. [13][14][15].…”

Section: Introductionmentioning

confidence: 99%

Numerical Analysis of the Desktop CPU's Straight Heatsink via a CFD Simulation Method to Achieve the Optimum Heatsink

Dipu,

Apu,

Chowdhury

2024

Preprint

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The straight heat sink is one of the most common heat transfer components for desktop CPUs in order to manage the dissipation of heat generated by the microprocessor. The primary goal of this study was to find out the optimal straight heat sink, initially by investigating three different fin thicknesses and several fin numbers in order to get the global minimum microprocessor temperature situation for each of those three different fin thicknesses, and finally by considering the mass and temperature of the heat sink in each of those three critical situations in order to get the optimal one. The CFD simulation method was applied to analyze the present study. Solidworks® software was used for both creating CAD models and performing simulations. Initially, it was found that each of the three different fin thicknesses had a turning point at which the microprocessor’s temperature was at its minimum. Later, the weight of the heat sink was also measured at those turning points. Firstly, the heat sink, whose thickness was 1 mm, had a microprocessor temperature of about 83.52 degrees Celsius and a weight of 307.80 grams. Secondly, the heat sink, whose thickness was 1.5 mm, had a microprocessor temperature of about 86.50 degrees Celsius and a weight of 388.80 grams. Thirdly, the heat sink, whose thickness was 2mm, had a microprocessor temperature of about 89.60 degrees Celsius and weighs 448.2 grams. Therefore, the heat sink with less fin thickness was the best one under the criteria of minimum microprocessor temperature and minimum heat sink mass. Because an optimum heat sink—for studied model, fin thickness of 1mm and number of fins of 21—provides a panacea for minimum material cost, light weight, and minimum microprocessor temperature.

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“…In hard disk manufacturing industries, substrates need to undergo cleaning process for enhancement [1]. The cleaning process consists of sub processes such as rinsing, blowing and heating.…”

Section: Introductionmentioning

confidence: 99%

Drying Droplets: A Review on its Numerical and Experimental Studies to Remove Coffee Ring Effect

Ying¹,

Ngali²,

Azmi³

et al. 2020

ARFMTS

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It is widely known that significant rejection percentage of substrates in the hard disk manufacturing industry is due to the stain appeared during drying of cleaning solution after platting process. Comparison of the characteristics and the causes of these stains suggested that the study of coffee ring effect (CRE) and droplets analysis are needed before any further analysis is carried out. In this review on CRE and droplets, both numerical and experimental works were critically analyzed. Previous studies have highlighted that the drying process of the water droplets are affected by the properties of the water droplets, substrate and temperature. Manipulation of Constant Contact Angle, Constant Contact Radius, advanced contact angle and receding contact angle by varying the arrangement of the substrates and the position of the drying equipment is required to attain the optimum setup to eliminate CRE. Furthermore, manipulation of the temperature of the substrates can enhance the drying process of the droplets before the formation of CRE but the process must not change the properties of the substrates. CRE formation also depends on the properties of the substrates and water droplets. Changing the chemical properties substrates are not advisable to eliminate CRE due to its complex design of the substrates for data storing. All the numerical tests have to be performed according to correct procedures to ensure accurate and acceptance by the industries. Verified and validated results from the evaluation will help to accurately predict the real consequences for further optimization. Knowing that the formation of CRE is caused by the evaporating of the water droplets, we need to find ways to eliminate the formation of water droplets before the heating process, in order to eliminate CRE.

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Use of Heat Transfer Enhancement Techniques in the Design of Heat Exchangers

Cited by 4 publications

References 25 publications

Pengaruh Kenaikan Laju Alir Fluida Panas dan Arah Aliran terhadap Kinerja Plate and Frame Heat Exchanger

Pengaruh Kenaikan Laju Alir Fluida Panas dan Arah Aliran terhadap Kinerja Plate and Frame Heat Exchanger

Numerical Analysis of the Desktop CPU's Straight Heatsink via a CFD Simulation Method to Achieve the Optimum Heatsink

Drying Droplets: A Review on its Numerical and Experimental Studies to Remove Coffee Ring Effect

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