User Manual for the Corryvreckan Test Beam Data Reconstruction Framework, Version 1.0

Kröger, Jens; Spannagel, Simon; Williams, Morag

doi:10.48550/arxiv.1912.00856

Cited by 4 publications

(4 citation statements)

References 11 publications

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“…The second part of the characterization was performed at test beam facilities with minimum ionizing particles. The analysis is based on a reconstruction software [5] that fits General Broken Lines to clusters on the reference planes and, subsequently, by interpolating the tracks to the DUT,1 associates or discards the tracks. Plenty of test beam campaigns have been completed starting from 2021 with the goal of measuring the detection efficiency and the fake-hit-rate2 (FHR).…”

Section: In-beam Measurementsmentioning

confidence: 99%

Validation of the 65 nm TPSCo CMOS imaging technology for the ALICE ITS3

Ferrero

2024

J. Inst.

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During the next Long Shutdown (LS3) of the LHC, planned for 2026, the innermost three layers of the ALICE Inner Tracking System will be replaced by a new vertex detector composed of curved ultra-thin monolithic silicon sensors. The R&D initiative on monolithic sensors of the CERN Experimental Physics Department, in cooperation with the ALICE ITS3 upgrade project, prepared the first submission of chip designs in the TPSCo 65 nm technology, called MLR1 (Multi Layer Reticle). It contains four different test structures with different process splits and pixel designs. These proceedings illustrate the first validation of the technology in terms of pixel performance and radiation hardness.

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Section: In-beam Measurementsmentioning

confidence: 99%

Validation of the 65 nm TPSCo CMOS imaging technology for the ALICE ITS3

Ferrero

2024

J. Inst.

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“…Test beam data were analysed with the C++ based framework Corryvreckan [21], more details can be found in [22]. In particular, reconstructed particle tracks passing through disabled or masked…”

Section: Test Beam Setup and Data Analysismentioning

confidence: 99%

Qualification of the first pre-production 3D FBK sensors with ITkPixV1 readout chip

Ressegotti¹,

Calderini²,

Crescioli³

et al. 2023

Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)

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The ITk detector, the new ATLAS silicon tracking system for the High Luminosity LHC (HL-LHC), will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be 25×100 µm 2 in the barrel and 50×50 µm 2 in the end-caps, with one readout electrode at the centre of each pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50×50 µm 2 ) produced by FBK have been bump-bonded to ITkPixV1.1 chips at IZM. Bare modules have been assembled in Genoa on Single Chip Cards (SCCs) and characterized in laboratory measurements and in test beam campaigns. Some of these modules have been irradiated in Bonn and at the CERN IRRAD facility. Preliminary results of their characterization after irradiation are shown, including measurements performed during test beam campaigns at CERN SPS in Summer 2022.

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“…The SCCs, tuned to a 1000 e threshold, were perpendicular to the beam inside an aluminum cold box. Data have been reconstructed and analyzed using the Corryvreckan [22] framework. Data in EUDAQ native raw format were loaded into Corryvreckan, the noisy pixels were masked on each device, then the telescope planes were aligned, followed by the DUTs.…”

Section: Beam Testmentioning

confidence: 99%

Test of ITk 3D sensor pre-production modules with ITkPixV1.1 chip

et al. 2023

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ITk detector, the new ATLAS tracking system at High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be either 25 × 100 μm2 (barrel) or 50 × 50 μm2 (endcap), with one read-out electrode at the centre of a pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50 × 50 μm2) produced by FBK have been bump bonded to ITkPixV1.1 chips at IZM. Bare modules have been assembled in Genoa on Single Chip Cards and characterized in laboratory and on beam.

show abstract

User Manual for the Corryvreckan Test Beam Data Reconstruction Framework, Version 1.0

Cited by 4 publications

References 11 publications

Validation of the 65 nm TPSCo CMOS imaging technology for the ALICE ITS3

Validation of the 65 nm TPSCo CMOS imaging technology for the ALICE ITS3

Qualification of the first pre-production 3D FBK sensors with ITkPixV1 readout chip

Test of ITk 3D sensor pre-production modules with ITkPixV1.1 chip

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