Using a low-energy proton beam to cross-link polymer films for the protection of inorganic substrates

Abstract

Oxidation and corrosion effects on virgin copper and silicon substrates under ambient conditions largely restrict their electronic and microelectronic applications in industrial fields. In this paper, we first aimed to fabricate cross‐linked organic thin films on a copper substrate by bombardment with a low‐energy proton beam, thus enhancing the films' anti‐oxidization ability under ambient conditions, as confirmed using X‐ray photoelectron spectroscopy and atomic force microscopy. The anti‐oxidization ability of the cross‐linked polymer films on silicon substrate was also considered. Copyright © 2016 John Wiley & Sons, Ltd.