Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Abstract

The increased power consumption and continued miniaturization of high-powered electronic components has presented many challenges to their thermal management. To improve the efficiency and reliability of these devices, the high amount of heat that they generate must be properly removed. In this paper, a three-dimensional numerical model has been developed and experimentally validated for several manifold heat sink designs. The goal was to enhance the heat sink's thermal performance while reducing the required pumping power by lowering the pressure drop across the heat sink. The considered designs were benchmarked to a commercially available heat sink in terms of their thermal and hydraulic performances. The proposed manifolds were designed to distribute fluid through alternating inlet and outlet branched internal channels. It was found that using the manifold design with 3 channels reduced the thermal resistance from 0.061 to 0.054 °C/W with a pressure drop reduction of 0.77 kPa from the commercial cold plate. A geometric parametric study was performed to investigate the effect of the manifold's internal channels width on the thermohydraulic performance of the proposed designs. It was found that the thermal resistance decreased as the manifold's channel width decreased, up until a certain width value, below which the thermal resistance started to increase while maintaining low pressure drop values. Where the thermal resistance significantly decreased in the 7 channels design by 16.4% and maintained a lower pressure drop value below 0.6 kpa.

Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications

“…Many of them need continual cooling to produce the desired outputs. [ 1,2 ] Some applications extend the range from −65 to +125 °C, such as military applications. [ 3 ] Moreover, there are many applications require reliable operations at temperatures exceeding 200 °C, such as automotive, geothermal energy applications, oil exploration, aerospace, and hypersonic applications.…”

“…Many of them need continual cooling to produce the desired outputs. [1,2] Some applications extend the range from À65 to þ125 °C, such as military applications. [3] There is a growing interest in the development of microelectronics that can perform reliably and robustly at temperatures above 300 °C.…”