Using Laser-Based Thermal Stress Cleaving to Trim the Edges of Rectangular Glass Plates

A novel method by microwave cutting ceramics based on thermal crack and trajectory control

“…It is considered that the crack propagation behavior is controlled by the intensity factor of the maximum tangential stress, and the strength factors of the edge defects with different sizes are calculated by finite element simulation. In 2009, Motomura F et al [21,22] simulated the process of CO2 laser cutting glass and studied the influence of constraints, surface heat transfer, material thickness and other factors on laser heating temperature and glass fracture strength factor. The research results showed that the stronger the surface heat dissipation capacity, the closer the crack tip was to the center of heat source.…”

Finite Element Analysis for Optimal Heating Condition in Thermal Stress Cleaving of Brittle Materials Using Laser Irradiation

“…On the other hand, the crack propagation velocity varies considerably especially when the crack tip locates near the plate edges even when the laser heat source moves in a constant velocity. The crack propagation that follows a moving heat source can be treated quasi statically under the theory of thermo-elasticity and is analyzed quantitatively by finite element method [1][2][3][4][5][6]. In the present analysis a symmetrical cleaving problem of a rectangular plate is chosen as a numerical example.…”