Using nano-porous Au-Ag sheets as a joint layer for low-temperature Au-Au bonding

Mimatsu, Hayata; Mizuno, Jun; Kasahara, Takashi; Saito, Mikiko; Nishikawa, Hiroshi; Shoji, Shuichi

doi:10.1109/icsj.2012.6523449

Cited by 2 publications

(1 citation statement)

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“…Therefore, many bonding processes operated at low temperature or room temperature were developed [1,2]. One approach of decreasing the bonding temperature was to use nanoscale structure and materials in bonding process [3][4][5][6]. For instance, Alarifi used Ag nanoparticle paste to bond copper wire on copper foil at 160 C [7].…”

Section: Introductionmentioning

confidence: 99%

Investigation of ultrasonic bonding interface based on Ni micro-nano cones array

Wang¹,

Hu²,

Li³

2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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Ultrasonic bonding based on Ni micro-nano cones array (MCA) was developed in this study. Interfacial morphologies of bonding joints were investigated. The deformation of nanocones demonstrated the complexity of initial indentation process. Analysis of morphology evolution under different bonding pressure revealed that interfacial voids shrinkage faster as pressure increase. The time dependent morphology evolution was varied under different bonding pressure. The critical bonding pressure was defined as 7MPa. Under the pressure lower than 7MPa, longer bonding time did not enhance the joint but extended the voids to cracks. As bonding pressure raised to 7MPa or larger, bonding time strengthened the joint and void shrinkage process was observed. The Ni MCA morphology evolution from cone-like to ladder-like and finally plane-like was observed in the interfaces. Keywords-Ultrasonic bonding, interfacial morphology, MCA, nickle, tin 2014 15th International Conference on Electronic Packaging Technology 978-1-4799-4707-2/14/$31.00 ©2014 IEEE

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