Using quantum dots to evaluate subsurface damage depths and formation mechanisms in glass

Mullany, Brigid; Parker, Wesley; Moyer, Patrick J.; Randles, Mark H.

doi:10.1016/j.cirp.2010.03.137

Cited by 17 publications

(6 citation statements)

References 23 publications

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“…Neauport et al [35] added a little amount of barium into slurry during grinding, tracked the barium at different etching depths with the inductively coupled plasmaatomic emission spectrometry (ICP-AES), and inferred the depth of subsurface cracks. Similarly, "quantum dots" were used during lapping to detect the subsurface cracks [99,100]. The quantum dots were fluorescent particles of the nanometer-size.…”

Section: Other Methodsmentioning

confidence: 99%

Methods for Detection of Subsurface Damage: A Review

Yin

Bai

2018

Chin. J. Mech. Eng.

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Subsurface damage is easily induced in machining of hard and brittle materials because of their particular mechanical and physical properties. It is detrimental to the strength, performance and lifetime of a machined part. To manufacture a high quality part, it is necessary to detect and remove the machining induced subsurface damage by the subsequent processes. However, subsurface damage is often covered with a smearing layer generated in a machining process, it is rather difficult to directly observe and detect by optical microscopy. An efficient detection of subsurface damage directly leads to quality improvement and time saving for machining of hard and brittle materials. This paper presents a review of the methods for detection of subsurface damage, both destructive and non-destructive. Although more reliable, destructive methods are typically time-consuming and confined to local damage information. Non-destructive methods usually suffer from uncertainty factors, but may provide global information on subsurface damage distribution. These methods are promising because they can provide a capacity of rapid scan and detection of subsurface damage in spatial distribution.

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Section: Other Methodsmentioning

confidence: 99%

Methods for Detection of Subsurface Damage: A Review

Yin

Bai

2018

Chin. J. Mech. Eng.

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“…The glass moulded crowns were good enough for the light hardening of the dental glue. Future work should focus on the investigation of the sub-surface damage (fractured and stressed material under an apparently defect-free surface [12]) in the transparent crowns. A quantitative analysis for the optical transparency of the moulded crowns should be performed.…”

Section: Discussionmentioning

confidence: 99%

Process chains for the mass production of transparent crowns for posterior teeth

Islam

Hansen

Rabenow³

et al. 2019

CIRP Annals

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This paper presents the work associated with the development of an innovative crown for posterior teeth. The idea is to produce a transparent cap that is mounted on top of the tooth, in this way facilitating the gluing of the crown and ensuring a good visual compatibility with the existing tooth. For the proposed crown concept, two properties are especially important -surface roughness and transparency. The paper presents the development and evaluation of two process chains based on industrially adaptive production methods. The process chains are compared based on their ability to meet product specifications in terms of roughness, transparency and mechanical properties.

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“…Fluorescence confocal microscopy can detect SSDs by insertion of a fluorescence-enhancement medium and imaging with photoluminescence under laser excitation. Williams et al 114,115 marked the subsurface cracks of optical glass by adding nanoscale fluorescent particles (diameter less than 10 nm) into the processing fluid and calibrated the SSD layer depth by observing the fluorescence signal of particles. Wang et al 116 used 7-10 nm CdSe/ZnSn watersoluble core-shell nanocrystals to detect the structure and distribution of SSD layers.…”

Section: Nondestructive Detectionmentioning

confidence: 99%

3D microscopy in industrial measurements

You

Liu

et al. 2022

Journal of Microscopy

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Quality control is essential to ensure the performance and yield of microdevices in industrial processing and manufacturing. In particular, 3D microscopy can be considered as a separate branch of microscopic instruments and plays a pivotal role in monitoring processing quality. For industrial measurements, 3D microscopy is mainly used for both the inspection of critical dimensions to ensure the design performance and detection of defects for improving the yield of microdevices. However, with the progress of advanced manufacturing technology and the increasing demand for high‐performance microdevices, 3D microscopy has ushered in new challenges and development opportunities, such as breakthroughs in diffraction limit, 3D characterisation and calibrations of critical dimensions, high‐precision detection and physical property determination of defects, and application of artificial intelligence. In this review, we provide a comprehensive survey about the state of the art and challenges in 3D microscopy for industrial measurements, and provide development ideas for future research. By describing techniques and methods with their advantages and limitations, we provide guidance to researchers and developers about the most suitable technique available for their intended industrial measurements.

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Using quantum dots to evaluate subsurface damage depths and formation mechanisms in glass

Cited by 17 publications

References 23 publications

Methods for Detection of Subsurface Damage: A Review

Methods for Detection of Subsurface Damage: A Review

Process chains for the mass production of transparent crowns for posterior teeth

3D microscopy in industrial measurements

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