2017
DOI: 10.2320/matertrans.m2017227
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Using Recycled Bismuth-Tin Solder in Novel Machinable Lead-Free Brass

Abstract: The aim of this work was to create and apply a recycled bismuth-tin (Bi-Sn) solder in novel machinable lead-free brass. The Bi-Sn alloys were obtained from a recycled solder used in the electronics industry to reduce cost and to partially solve electronic waste issue. The relationship between mechanical properties, microstructures and machinability of the brass were investigated. The results showed that a based lead-free Cu-38Zn-0.5Si brass without Bi-Sn alloy addition exhibited highest tensile strength, requi… Show more

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Cited by 8 publications
(11 citation statements)
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“…The phase transformation of these alloys related with zinc equivalent were explained in details in our previous work. 21) In addition, Fig. 1(a) of specimens with 1 mass% BiSn alloy additions showed that the bismuth particles were embedded in the beta phase and at the alpha-beta phase boundaries.…”
Section: Microstructures and Chemical Analysismentioning
confidence: 94%
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“…The phase transformation of these alloys related with zinc equivalent were explained in details in our previous work. 21) In addition, Fig. 1(a) of specimens with 1 mass% BiSn alloy additions showed that the bismuth particles were embedded in the beta phase and at the alpha-beta phase boundaries.…”
Section: Microstructures and Chemical Analysismentioning
confidence: 94%
“…Lead-free brass in this study consisted of Cu38Zn with 0.5 mass% silicon with various 14 mass% BiSn alloys, as described in details in our previous work. 21) The alloys were prepared with high purity copper (Bangkok Assays, ²99.5%), zinc (Padaeng Industry, 99.9%), silicon (S.M. Chemical Supplies, 99.5%), and a recycled electronic solder, which is an alloy composed of 52Bi48Sn.…”
Section: Methodsmentioning
confidence: 99%
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“…A lead-free machinable brass (CuZn40) exhibiting good balance between the elongation and the machinability was obtained by using the mixed powder containing 0.5 wt % graphite particles and 2.2 wt % Bi additions [11]. Relevant research revealed the benefits of the recycled bismuth-tin solder addition in lead-free brass alloy (Cu-38Zn-0.5Si) by reducing the chip-size morphology as well as the required cutting force [12]. The improvement of chip-breaking efficiency was attributed to the presence of κ-phase in CuZn21Si3P, as opposed to the effect of α-phase in CuZn38As brass.…”
Section: Introductionmentioning
confidence: 99%