Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package

Pekkanen, Ville; Mäntysalo, Matti; Kaija, Kimmo; Mansikkamäki, Pauliina; Kunnari, Esa; Laine, Katja; Niittynen, Juha; Koskinen, Santtu; Halonen, Eerik; Caglar, Umur

doi:10.1016/j.mee.2010.04.013

Cited by 42 publications

(15 citation statements)

References 15 publications

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“…Inkjet printing technology uses cartridges to inkjet small amounts of functional inks directly and accurately on to a substrate [48]. With the development of nanotechnology, new materials, such as inorganic nanoparticles, carbon nanotubes, and graphene inks, have been developed to build high performance components and large-area electronics that are thin, light weight, flexible or stretchable [49]. Due to the features of additive and digital manufacture processes, inkjet printing is mask-free and free of material waste, therefore it is a 'green' and cost-effective assembly approach for electronic systems [50].…”

Section: B Inkjet Printed Electrodes and Interconnectionsmentioning

confidence: 99%

A Health-IoT Platform Based on the Integration of Intelligent Packaging, Unobtrusive Bio-Sensor, and Intelligent Medicine Box

Yang

Xie

Mäntysalo³

et al. 2014

IEEE Trans. Ind. Inf.

594

186

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Section: B Inkjet Printed Electrodes and Interconnectionsmentioning

confidence: 99%

A Health-IoT Platform Based on the Integration of Intelligent Packaging, Unobtrusive Bio-Sensor, and Intelligent Medicine Box

Yang

Xie

Mäntysalo³

et al. 2014

IEEE Trans. Ind. Inf.

594

186

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“…Surface tension and viscosity are important factors of ink for inkjet printing. 28,29 As summarized in Table I, the viscosities of the potential solvents, hexadecane (HD), tetradecane (TD), and a mixture of both (MTH, 50 wt.% HD plus 50 wt.% TD), were 2.16 cP for pure TD, 3.51 cP for MTH, and 3.85 cP for HD. HD was selected as a promising candidate solvent because it had the highest viscosity.…”

Section: Conductive Ink and Sinteringmentioning

confidence: 99%

A Simple Process for Synthesis of Ag Nanoparticles and Sintering of Conductive Ink for Use in Printed Electronics

Jung

Kim

et al. 2011

Journal of Elec Materi

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Various-sized Ag nanoparticles capped with oleylamine were synthesized by means of a thermal decomposition process for low-temperature electronic devices. The Ag nanoparticles, which had diameter of 5.1 nm to 12.2 nm, were synthesized in incubation and ripening stages related to nucleation and growth. After the Ag nanoparticles were made into ink with a proper solvent, inkjet printing and thermal sintering methods were used to form a metal thin film with thickness of 100 nm. A type of thermal sintering related to percolation transformation and surface sintering was conducted at a temperature much lower than the melting point of bulk Ag. The electrical resistivity was examined with the aid of a four-point probe system and compared with the resistivity of bulk Ag, showing that the Ag film had much higher resistivity than bulk Ag. To improve the electrical stability and properties, we applied hexamethyldisilazane (HMDS) surface treatment to the substrate and dipped the as-deposited films into methanol. Both treatments helped to diminish and stabilize the resistivity of the printed conductive films.

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“…The use of TDR measurement for failure analysis of electrical interconnections of BGA (Ball Grid Array) and other packaging is presented in [7][8][9]. The analysis involved nondestructive tests of packaged ICs and it was able to identify the location of a failure and classify open-and short-circuit defects.…”

Section: Introductionmentioning

confidence: 99%

Failure Mode Characterization in Inkjet-Printed CPW Lines Utilizing a High-Frequency Network Analyzer and Post-Processed TDR Analysis

Myllymäki¹,

Putaala²,

Hannu³

et al. 2013

PIER C

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Abstract-Failure mode characterization was applied to coplanar transmission lines by utilizing 0.5-10-GHz S-parameter measurements and post-calculated TDR (Time-Domain-Reflectometry) analysis. Coplanar waveguide transmission lines were inkjet-printed on 1.0-mmthick flexible plastic RF substrates. Inductive, resistive, and capacitive types of failures -as the main failure modes caused by manufacturing, bending, or thermal cycling stresses -were investigated. The inkjetprinted CPW (Co-Planar Waveguide) lines were damaged by inductive shorts due to mechanical hitsor resistive and capacitive failures due to bending of the substrate. By using the TDR method the type and physical location of the failure can be determined.

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Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package

Cited by 42 publications

References 15 publications

A Health-IoT Platform Based on the Integration of Intelligent Packaging, Unobtrusive Bio-Sensor, and Intelligent Medicine Box

A Health-IoT Platform Based on the Integration of Intelligent Packaging, Unobtrusive Bio-Sensor, and Intelligent Medicine Box

A Simple Process for Synthesis of Ag Nanoparticles and Sintering of Conductive Ink for Use in Printed Electronics

Failure Mode Characterization in Inkjet-Printed CPW Lines Utilizing a High-Frequency Network Analyzer and Post-Processed TDR Analysis

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