PACS : 78.55.Cr; 78.66.Fd; 78.67.De; 85.60.Jb GaN/AlN supperlattice was used as the p-type cladding layer of UV-LED. I-V characteristics indicates that UV-LED having GaN/AlN supperlattice has much lower series resistance than the conventional UV-LED in which ternary alloy AlGaN was used as the cladding layer.Introduction High efficiency light emitting diodes (LEDs) in blue and green region based on group III nitride semiconductors have been developed by achieving several breakthroughs such as improvement of the crystalline quality of GaN using a low-temperature-deposited (LT-) buffer layer technique [1] and realization of conductivity control of nitrides [2][3][4]. In these devices, GaInN-based quantum wells are usually used as an active layer.Fabrication of UV devices will surely give a big impact on the applications such as super high-density optical storage, chemical sensing, flame detection, excitation source for phosphors or fine lithography. In order to establish such UV-devices, thick AlGaN films with high-AlN molar fraction and high-crystalline quality, high-efficiency AlGaN alloys active layers and low-resistance and wide-bandgap p-cladding layers are essential.We succeeded to grow high quality and thick AlGaN free of cracks using an LT-AlN interlayer technique [5]. High-sensitivity flame sensor was developed using this technique [6,7]. Transmission electron microscopic study showed that the pure screw-type and mixed-type dislocations in the AlGaN films were reduced, while high-density pure edge-type dislocation was still contained as high as mid 10 9 cm --2 in these films [8]. Therefore, the fabrication of highly luminescent AlGaN was difficult.In order to reduce all types of threading dislocations in GaN, novel growth technique called "epitaxial lateral overgrowth" has been performed and led to the success of growing partially very low dislocation density GaN [9]. Unfortunately, due to a strong adhesion of AlN on the mask surface, polycrystalline AlGaN is formed on the mask, which prohibits epitaxial lateral overgrowth of AlN containing alloys [10]. Moreover, this technique has the problem of crack generation. We succeeded to reduce all types of threading dislocations by combining low temperature interlayer and lateral growth technique. Details of the growth procedure have been reported elsewhere [11][12][13]. PL