UV light with oxygen treatment of phase shift photoblank for phase and transmission control: applicable to M x Si (1-x) O y N (y-1)

Abstract

A method based on UV in air environment to improve the stability of the material of the photoreticles throughout cleans repeated over is suggested in this work. A typical aggressive clean was performed on two different Embedded Shifter materials, 193nm Molybdenum-Silicon-Oxy-Nitride (MoSiON) and 193nm Multilayer Silicon Nitride-Titanium Nitride (SiN-TiN). The variation of phase and transmission of each reticle is reported with the number of cleans. Given the appropriate exposure the phase and the transmission of the treated materials were significantly improved. All treated EAPSMs could stand cleans repeated over.