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Styrkas, A. D.

doi:10.1023/a:1025065027495

Cited by 22 publications

(15 citation statements)

References 5 publications

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“…One of the reasons for this is the difficulty of carrying out reliable and reproducible laboratory experiments, as the sluggish ␤ → ␣ transition requires very long times, years in some reported cases [9], to be completed. Actually, the kinetics of the transition is very much influenced by the incubation time needed to the low temperature polymorph, ␣-tin, to nucleate.…”

Section: Introductionmentioning

confidence: 99%

“…Actually, the kinetics of the transition is very much influenced by the incubation time needed to the low temperature polymorph, ␣-tin, to nucleate. This step of the transition is strongly dependent on the presence of nucleating substances and environmental conditions [9] that may promote or hinder the occurrence of the transformation. A central role is also played by the mechanical constraints generated by the large volume expansion that is associated with the transition and that slows down both nucleation and growth of the ␣-phase.…”

Section: Introductionmentioning

confidence: 99%

“…Other nucleating agents, like, for instance, SnO and ice, have been considered and their effectiveness has been classified in terms of the time to nucleation they were able to induce [9]. As concerns SnO, it is generally present as a layer of native oxide on the metal surface.…”

Section: Introductionmentioning

confidence: 99%

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Kinetics and microstructural aspects of the allotropic transition in tin

Gialanella

Deflorian

Girardi

et al. 2009

Journal of Alloys and Compounds

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Kinetics and microstructural aspects of the allotropic transition in tin

Gialanella

Deflorian

Girardi

et al. 2009

Journal of Alloys and Compounds

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“…3 Ranging from a memory effect following a thermal cycle, through various forms of contact with seeds, to actual spontaneous initiation, incubation times between a few minutes and ''over 300 years'' are suggested. The role of water (vapor or ice) can be significant, since in its metastable form, the latter has a similar crystal structure and lattice parameter to those of a tin.…”

Section: Mechanismsmentioning

confidence: 99%

“…1 The process itself involves nucleation and growth, and may take years, or even decades, to occur without the assistance of artificial nucleation by seeds of a tin or crystals that have the same structure and similar lattice parameter. 2,3 Nucleation criteria are unknown, and the role of impurities may be critical. This could account for the inconsistency reported so far.…”

Section: Introductionmentioning

confidence: 99%

Further Observations on Tin Pest Formation in Solder Alloys

Plumbridge

2010

Journal of Elec Materi

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The most recent observations of the response of bulk samples of several commercial solder alloys, exposed to temperatures below the allotropic transition for tin (13°C) for extended periods, are reported. Damage associated with tin pest development has been arbitrarily graded into six levels, and the formation of visible a-phase warts used for comparative purposes. Since the previous examination, some 2 years ago, tin pest has been observed for the first time in the traditional Sn-37Pb solder alloy after exposure at À18°C and À40°C, and actual warts were apparent in as-cast Sn-0.5Cu stored at À40°C and in as-cast Sn-3.5Ag after exposure at À18°C. No tin pest was detected in Sn-Zn-3Bi after exposure for periods up to 6 years. Tin pest continued to develop in those lead-free alloys in which it had previously been observed, indicating the probability that all would eventually disintegrate in time. In general, prior thermal or mechanical treatment accentuated tin pest formation. The influence of exposure temperature was unclear, since some alloys (Sn-0.5Cu and Sn-3.8Ag-0.7Cu) experienced more damage at À18°C, but others (Sn-37Pb and Sn-3.5Ag) were more susceptible at À40°C. From a consideration of the findings and other published information, it is contended that impurity levels below 0.1 mass% (1000 ppm) play a vital role in determining whether tin pest develops in realistic timescales. A major factor in the absence of tin pest, to date, on actual joints may be simply the mismatch between the timescales experienced in service and those in long-duration laboratory tests.

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Sticking behavior and transformation of tin droplets on silicon wafers and multilayer-coated mirrors

Böwering

Meier

2019

Appl. Phys. A

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Silicon wafer and multilayer-coated mirror samples were exposed to impact of drops of molten tin to examine the adhesion behavior and cleaning possibilities. The sticking of tin droplets to horizontal substrates was examined for different surface conditions in a high vacuum chamber. Silicon wafers without a coating, with thick oxide top layer, and also with differently capped Mo/Si multilayer coatings optimized for reflection at a wavelength of 13.5 nm were exposed to tin dripping. Dependent on substrate temperature and coating, adhesion as well as detachment with self-peeling and self-contraction of spreaded drops was observed. The adhesion strength of solidified tin splats decreased strongly with decreasing substrate temperature. Non-sticking surface conditions could be generated by substrate super-cooling. The morphology of non-sticking tin droplets was analyzed by profilometry. Adhering deposits were converted in-situ via induction of tin pest by infection with gray tin powder and cooling of the samples. The phase transition was recorded by photographic imaging. It caused material embrittlement and detachment after structural transformation within several hours and enabled facile removal of tin contamination without coating damage. The temperature-dependent contamination behavior of tin drops has implications for the preferred operating conditions of extreme ultraviolet light sources with collection optics exposed to tin debris.2

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Cited by 22 publications

References 5 publications

Kinetics and microstructural aspects of the allotropic transition in tin

Kinetics and microstructural aspects of the allotropic transition in tin

Further Observations on Tin Pest Formation in Solder Alloys

Sticking behavior and transformation of tin droplets on silicon wafers and multilayer-coated mirrors

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