Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

Cheng, Yu‐Ting; Hsu, Wan-Thai; Lin, Liwei; Nguyen, C.T.-C.; Najafi, K.

doi:10.1109/memsys.2001.906468

Cited by 27 publications

(23 citation statements)

References 11 publications

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“…In particular, some protection from the environment is necessary, even if only to prevent contamination by particles (or even by molecules), or to isolate the device from electric fields or feedthrough currents. Needless to say, wafer-level encapsulation is presently the subject of intense research [31], [32].…”

Section: Circuits/mems Merging Technologiesmentioning

confidence: 99%

Vibrating RF MEMS for Low Power Communications

Nguyen

2002

MRS Proc.

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Micromechanical communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. Possible transceiver front-end architectures are then presented that use these micromechanical circuits in large quantities to substantially reduce power consumption. Technologies that integrate MEMS and transistor circuits into single-chip systems are then reviewed with an eye towards the possibility of single-chip communication transceivers.

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Section: Circuits/mems Merging Technologiesmentioning

confidence: 99%

Vibrating RF MEMS for Low Power Communications

Nguyen

2002

MRS Proc.

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“…The vacuum packaging technique can improve the mechanical quality by reducing the air damping and protect the packaged components from the external environments [3][4][5] . Nowadays, the vacuum packaging technology has been rapidly improved to enhance their performances [6] .…”

Section: Introductionmentioning

confidence: 99%

The Analysis of the Key Technologies of the Packaging Device Applied for the Epoxy Moulding Materials

Hong¹,

Hu²,

Wang³

et al. 2017

dtmse

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Abstract. The packaging device is the essential factor to determine the working efficiency and the packaging quality. The key technologies of the packaging device used for the multi-component moulding materials including the measuring-mixing system and the procedure control system were introduced and analyzed. It indicates that the measuring and mixing system composed of the volume measuring pump, the SK online mixer and the availably designed pouring valve is chosen after the comparison with the usually applied technologies. With the experimental results, the measuring accuracy can be limited to about 1% and the mixing units should be designed more than 32 joints. Furthermore, the main procedure control system is also displayed and described in detail in this paper.

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“…All vibratory structures have mechanical resonance characteristics that depend on the ambient pressure. That is, resonance characteristics can be used to estimate the ambient pressure [3][4][5]. Eq.…”

Section: Introductionmentioning

confidence: 99%

Wafer-Level Packaged MEMS Resonators with a Highly Vacuum-Sensitive Quality Factor

Kang¹,

Moon²,

Son³

et al. 2014

JSTS:Journal of Semiconductor Technology and Science

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Abstract-Mechanical stress and the vacuum level are the two main factors dominating the quality factor of a resonator operated in the vacuum range 1 mTorr to 10 Torr. This means that if the quality factor of a resonator is very insensitive to the mechanical stress in the vacuum range, it is sensitive to mainly the ambient vacuum level. In this paper, a wafer-level packaged MEMS resonator with a highly vacuumsensitive quality factor is presented. The proposed device is characterized by a package with out-of-plane symmetry and a suspending structure with only a single anchor. Out-of-plane symmetry helps prevent deformation of the packaged device due to thermal mismatch, and a single-clamped structure facilitates constraint-free displacement. As a result, the proposed device is very insensitive to mechanical stress and is sensitive to mainly the ambient vacuum level. The average quality factors of the devices packaged under pressures of 50, 100, and 200 mTorr were 4987, 3415, and 2127, respectively. The results demonstrated the high controllability of the quality factor by vacuum adjustment. The mechanical robustness of the quality factor was confirmed by comparing the quality factors before and after hightemperature storage. Furthermore, through more than 50 days of monitoring, the stability of the quality factor was also certified.

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Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

Abstract: factor of 9600 has been vacuum encapsulated and shown to be stable after 56 weeks.[686]

Cited by 27 publications

References 11 publications

Vibrating RF MEMS for Low Power Communications

Vibrating RF MEMS for Low Power Communications

The Analysis of the Key Technologies of the Packaging Device Applied for the Epoxy Moulding Materials

Wafer-Level Packaged MEMS Resonators with a Highly Vacuum-Sensitive Quality Factor

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