The growing use of high-power and integrated electronic
devices
has created a need for thermal conductive adhesives (TCAs) with high
thermal conductivity (TC) to manage heat dissipation at the interface.
However, TCAs are often limited by contact thermal resistance at the
interface between materials. In this study, we synthesized MXene@Ag
composites through a direct in situ reduction process.
The Ag nanoparticles (Ag NPs) generated by the reduction of the MXene
interlayer and surface formed effective thermally conductive pathways
with Ag flakes within an epoxy resin matrix. Various characterization
analyses revealed that adding MXene@Ag composites at a concentration
of 3 wt % resulted in a remarkable TC of 40.80 W/(m·K). This
value is 8.77 times higher than that achieved with Ag flakes and 7.9
times higher than with MXene filler alone. The improved TC is attributed
to the sintering of the in situ reduced Ag NPs during
the curing process, which formed a connection between MXene (a highly
conductive material) and the Ag flakes, thereby reducing contact thermal
resistance. This reduction in contact thermal resistance significantly
enhanced the TC of the thermal interface materials (TIMs). This study
presents a novel approach for developing materials with exceptionally
high TC, opening new possibilities for the design and fabrication
of advanced thermal management systems.