2008
DOI: 10.1016/j.surfcoat.2008.06.110
|View full text |Cite
|
Sign up to set email alerts
|

Vapor deposition and characterization of nanocrystalline nanolaminates

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

1
11
0

Year Published

2010
2010
2020
2020

Publication Types

Select...
7

Relationship

2
5

Authors

Journals

citations
Cited by 16 publications
(12 citation statements)
references
References 49 publications
1
11
0
Order By: Relevance
“…The measured H-values of 2-4 GPa for Cu-C are typical as reported (Jankowski, 2008) for nc Cu. It is seen in Figure 7 that as the indentation depth increases, the H-values begin to converge towards the known hardness for Silicon at ~10 GPa.…”
Section: Mechanical Propertiessupporting
confidence: 75%
See 2 more Smart Citations
“…The measured H-values of 2-4 GPa for Cu-C are typical as reported (Jankowski, 2008) for nc Cu. It is seen in Figure 7 that as the indentation depth increases, the H-values begin to converge towards the known hardness for Silicon at ~10 GPa.…”
Section: Mechanical Propertiessupporting
confidence: 75%
“…The variation in the Ni-C results appears to be dependent upon the specific regions of the surface that are probed wherein each of the nine indents is separated by 50-100 µm. The H-values for Ni-C are found to range from a lower bound that is typical for nanocrystalline (nc) Ni at 6-8 GPa (Jankowski, 2008) to upper bound values that are an average for a mixture of nc Ni and dlc C (Robertson, 2002).…”
Section: Mechanical Propertiesmentioning
confidence: 93%
See 1 more Smart Citation
“…If there is a high amplitude to short-wavelength surface roughness, then multiple point contact can occur which could appear to artificially stiffen the mechanical response. Smooth surfaces and a nanocrystalline structure for tantalum (Ta), vanadium (V), and nickel (Ni) coatings are produced from the high-quench rates (>10 6 K⋅s −1 ) of the sputter deposition method [30][31][32][33][34]. The metals are coated onto polished flats such as semiconductor-grade silicon and sapphire wafers.…”
Section: Methodsmentioning
confidence: 99%
“…Details of the structural characterization for the Ta, V, and Ni sputter deposited coatings are reported elsewhere [30,35]. The characterization methods consisted of X-ray diffraction (XRD), transmission electron microscopy (TEM), and atomic force microscopy (AFM).…”
Section: Methodsmentioning
confidence: 99%