Vapor pressure analysis of popcorn cracking in plastic IC packages by fracture mechanics

Lim, Jihoon; Lee, K.W.; Park, S.S.; Earmme, Youn-Young

doi:10.1109/eptc.1998.755976

Cited by 10 publications

(4 citation statements)

References 9 publications

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“…The evaporation pressure in the small defects tends to delaminate the package. The studies on the package delamination with hygrothermal coupling effects attracted many scientists and engineers [3][4][5].…”

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confidence: 99%

The energy release rate for hygrothermal coupling elastic materials

2006

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In the fracture problems of hydrophilic elastic materials under coupling effects of heat conduction, moisture diffusion and mechanical deformation, the conventional J -integral is no longer path independent. The value of J is unequal to the energy release rate in hygrothermal coupling cases. In the present paper, we derived a general form of the energy release rate for hygrothermal fracture problems of the hydrophilic elastic materials on the basis of energy balance equation in cracked areas. By introducing the constitutive relations and the essential equations of irreversible thermodynamics, a specific expression of the energy release rate was obtained, and the expression can be reformmulated as path independent integrals, which is equivalent to the energy release rate of the fracture body. The path independence of the integrals is then verified numerically.

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confidence: 99%

The energy release rate for hygrothermal coupling elastic materials

2006

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“…By simplifying the package as a plate, Lim et al. [12] developed a model using plate theory for modelling the vapour pressure and volume of delamination. The model requires an input of the mass of the moisture diffused into the delamination, but it does not involve how to calculate the diffused moisture.…”

Section: Existing Techniquesmentioning

confidence: 99%

Vapour Pressure Modelling for Plastic Encapsulated Microelectronics Subjected to Lead‐Free Solder Reflow Profile

Wang

2011

Strain

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A universal, practical vapour pressure modelling scheme for the plastic encapsulated microelectronics (PEMs) subjected to lead‐free solder reflow profile and other high temperature conditions is presented. The proposed technique employs finite‐element moisture diffusion and structural analysis to calculate the dynamic vapour pressure buildups at the interfacial delaminations in the PEMs. The modelling scheme uses a non‐iterative approach, and it is capable of accurately and efficiently determining the dynamic vapour pressure information required for the reliability‐related design and failure analysis of various kinds of PEMs. The modelling scheme has considerable value to the development of new materials, innovative structures, and effective protection methods for enhancing the performance and reliability of plastic packages.

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“…Lim et.al. [3] employed the ideal-gas relation between vapor pressure and the accumulated moisture content to calculate the vapor pressure generated in the electronics package during the soldering process. Andrew A.…”

Section: Introductionmentioning

confidence: 99%

Development of vapor pressure in FR4-copper composite material during solder reflow process

Kamsah

Tamin

Kamar

et al. 2012

AIP Conference Proceedings

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This paper presents a finite element (FE) methodology for predicting the distribution of vapor pressure in a simple FR4-copper composite material when it is heated up to 215°C. A general purpose finite element software was used to develop a two-dimensional plane strain model of the composite material. FE simulation of transient moisture absorption was performed to predict the distribution of wetness fraction in the material after pre-conditioning at an 85°C/85%RH environment for 15 days. FE simulation of transient moisture desorption was carried out at the peak solder reflow temperature of 215°C to predict new distribution of wetness fraction in the material. The results of the moisture desorption analysis were used to compute the magnitude of vapor pressure in the material and its distribution at 215°C. It was found that the moisture in the material redistributes itself during solder reflow. The moisture concentration in the area close to the FR4-copper interface below the longer copper trace increases during the solder reflow. The magnitude of the vapor pressure in 70% of the FR4 and near the FR4-copper interface below the lower copper trace is closed to the saturation pressure of water vapor at 215°C. The distribution of the vapor pressure in the material is in similar fashion as the new distribution of wetness fraction after the moisture desorption analysis.

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Vapor pressure analysis of popcorn cracking in plastic IC packages by fracture mechanics

Cited by 10 publications

References 9 publications

The energy release rate for hygrothermal coupling elastic materials

The energy release rate for hygrothermal coupling elastic materials

Vapour Pressure Modelling for Plastic Encapsulated Microelectronics Subjected to Lead‐Free Solder Reflow Profile

Development of vapor pressure in FR4-copper composite material during solder reflow process

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