Variable Pumping Control for Low Power Microfluidic Chip Cooling

Luz, S. Da; Kattinger, G.; Laguna, Gerard; Azarkish, Hassan; Vilarrubí, Montse; Collin, Louis-Michel; Fréchette, Luc; Barrau, Jérôme; Billat, S.

doi:10.1109/therminic.2018.8593279

Cited by 1 publication

(1 citation statement)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…For instance, Zhang et al [81] developed an adaptive control law for the thermal-fluidic control of a microchannel evaporator, which estimated the heat transfer coefficient and adjusted the flow rate accordingly. Also, Da Luz et al [82] proposed to adapt the pumping conditions to provide the minimum flow rate required to maintain the maximum chip temperature, through a variable flow miniaturized pump system with an associated electronics drive (Figure 7). Recently, Shahi et al [83] explored the implementation of active flow control at the server level Crystallographic behavior of SMA valves in function of its temperature.…”

Section: Flow Rate Regulationmentioning

confidence: 99%

Perspective Chapter: Smart Liquid Cooling Solutions for Advanced Microelectronic Systems

Vilarrubí

2024

Heat Transfer - Advances in Fundamentals and Applications

View full text Add to dashboard Cite

Thermal management is today a primary focus in the electronics industry due to the continuous increase of power density in chips increasingly smaller in size, which has become a critical issue in fast-growing industries such as data centers. As air-cooling fails to meet the high heat extraction demands of this sector, liquid cooling emerges as a promising alternative. Nevertheless, advanced microelectronic components require a cooling system that not only reduces the energetic consumption but also enhances the thermal performance by minimizing the thermal resistance and ensuring high-temperature uniformities, especially under variable heat load scenarios with high heat dissipating hotspot regions, where conventional liquid cooling solutions prove inefficient. This chapter provides an overview of different passive heat transfer enhancement techniques of micro heat sinks from the literature, focusing on intelligent and adaptive solutions designed to optimize the cooling performance based on local and instantaneous cooling requirements for non-uniform and time-dependent power distribution maps.

show abstract

Section: Flow Rate Regulationmentioning

confidence: 99%

Perspective Chapter: Smart Liquid Cooling Solutions for Advanced Microelectronic Systems

Vilarrubí

2024

Heat Transfer - Advances in Fundamentals and Applications

View full text Add to dashboard Cite

show abstract

Variable Pumping Control for Low Power Microfluidic Chip Cooling

Cited by 1 publication

References 6 publications

Perspective Chapter: Smart Liquid Cooling Solutions for Advanced Microelectronic Systems

Perspective Chapter: Smart Liquid Cooling Solutions for Advanced Microelectronic Systems

Contact Info

Product

Resources

About