Various silicon‐containing polymers with Si(H)CC units

Abstract

Nine new kinds of thermosetting polymers with the Si(H)OC'C unit were synthesized by dehydrogenative polycondensation reactions between hydrosilanes and diethynyl compounds in the presence of a magnesia catalyst. Phenylsilane, silane, vinylsilane, and n-octylsilane were used as the hydrosilanes, and 1,3-diethynylbenzene, 1,4-diethynylbenzene, 4,4Ј-diethynyldiphenyl ether, and 1,3-diethynyl-1,1,3,3-tetramethyldisiloxane were used as the diethynyl compounds. All the polymers were thermosetting, highly heat-resistant, easily soluble in a solvent, and moldable. In particular, OSi(R)HOC'COC 6 H 4 OC'CO (R ϭ H or CHACH 2 ) showed high thermal stability; the temperature of 5% weight loss was greater than 800°C, and the residue at 1000°C was over 90%. The thermal stabilities of the polymers were attributed to the crosslinking reaction of the SiOH and C'C bonds.

Synthesis and Properties of Arylacetylene Resins with Siloxane Units

“…[4][5][6][7][8][9][10][11][12][13] Itoh and coworkers have developed a silicon-containing polyarylacetylene. 4 The siliconcontaining polyarylacetylene, poly[(phenylsilyleneethynylene-1,3-phenyleneethynylene)] (named MSP), was synthesized by dehydrogenative coupling polymerization reactions between phenylsilane and m-diethynylbenzene.…”

“…The potential applications of the MSP materials are considered as composite materials, ceramic materials, and electronic materials. [4][5][6][7] In 2001, phenylacetylene terminated poly(silyleneethynylenephenyleneethynylene) oligomers abbreviated as BLJ were synthesized by the condensation reaction between dichlorosilane and a mixture of diethynylbenzene and phenyl acetylene magnesium reagents. 8 This BLJ resin is an easily processable polymer and cured at elevated temperature to form a crosslinked polymer with high heat resistance and high char yield.…”

Thermal cure behavior and pyrolysis of methyl‐tri(phenylethynyl)silane resin

“…[6][7][8][9][10][11] Itoh reported that poly[(phenylsilylene)ethynylene-1,3-phenyleneethynylene] [ASi(ph) HACBCAC 6 H 4 ACBCA] (abbreviated MSP), which was prepared by the dehydrogenative coupling polymerization reaction between phenylsilane and mdiethynylbenzene in the presence of magnesium oxide, had extremely high thermal stability. [12][13][14] In our previous article, [15][16][17] synthesis, characterization, and thermal cure kinetics of methyl-tri(phenylethynyl) silane (MTPES) had been reported and thermoset possessed excellent thermal and oxidative properties. The temperature of 5% weight loss (Td 5 ) in nitrogen was 695 C and total weight loss at 800 C was 7.1% as shown thermo gravimetric analysis.…”

Synthesis and characterization of new disilane -containing arylacetylene resin

“…During the curing process of arylacetylene resins, no byproducts were released. In the last decade, modifications of arylacetylene resins with silanes have been discussed extensively because of the unique optical and electronic properties and the potential applications of these resins as ceramic precursors, electronic materials, etc [7][8][9][10][11][12][13][14][15][16]. Itoh, et al synthesized and characterized poly(phenylsilyleneethynylene-1,3-phenyleneethynylene) , abbreviated as MSP and the results showed that the polymer had an extremely high thermal stability after crosslinking [10,12].…”