“…After completion of the device fabrication, the substituted blocking liquid is flushed out using a solvent or drained using a vacuum. While dissolvable solid supports 38 , 39 may also be used to print hollow spaces, our process avoids the need to design dissolvable resin systems, and the use of a liquid instead of a solid facilitates easier removal from complex micrometer scale hollow geometries. Figure 1 Fabrication of hollow geometries and mitigation of print-through using the blocking liquid substitution process.…”
Micrometer scale arbitrary hollow geometries within a solid are needed for a variety of applications including microfluidics, thermal management and metamaterials. A major challenge to 3D printing hollow geometries using stereolithography is the ability to retain empty spaces in between the solidified regions. In order to prevent unwanted polymerization of the trapped resin in the hollow spaces—known as print-through—significant constraints are generally imposed on the primary process parameters such as resin formulation, exposure conditions and layer thickness. Here, we report on a stereolithography process which substitutes the trapped resin with a UV blocking liquid to mitigate print-through. We investigate the mechanism of the developed process and determine guidelines for the formulation of the blocking liquid. The reported method decouples the relationship between the primary process parameters and their effect on print-through. Without having to optimize the primary process parameters to reduce print-through, hollow heights that exceed the limits of conventional stereolithography can be realized. We demonstrate fabrication of a variety of complex hollow geometries with cross-sectional features ranging from tens of micrometer to hundreds of micrometers in size. With the framework presented, this method may be employed for 3D printing functional hollow geometries for a variety of applications, and with improved freedom over the printing process (e.g. material choices, speed and resulting properties of the printed parts).
“…After completion of the device fabrication, the substituted blocking liquid is flushed out using a solvent or drained using a vacuum. While dissolvable solid supports 38 , 39 may also be used to print hollow spaces, our process avoids the need to design dissolvable resin systems, and the use of a liquid instead of a solid facilitates easier removal from complex micrometer scale hollow geometries. Figure 1 Fabrication of hollow geometries and mitigation of print-through using the blocking liquid substitution process.…”
Micrometer scale arbitrary hollow geometries within a solid are needed for a variety of applications including microfluidics, thermal management and metamaterials. A major challenge to 3D printing hollow geometries using stereolithography is the ability to retain empty spaces in between the solidified regions. In order to prevent unwanted polymerization of the trapped resin in the hollow spaces—known as print-through—significant constraints are generally imposed on the primary process parameters such as resin formulation, exposure conditions and layer thickness. Here, we report on a stereolithography process which substitutes the trapped resin with a UV blocking liquid to mitigate print-through. We investigate the mechanism of the developed process and determine guidelines for the formulation of the blocking liquid. The reported method decouples the relationship between the primary process parameters and their effect on print-through. Without having to optimize the primary process parameters to reduce print-through, hollow heights that exceed the limits of conventional stereolithography can be realized. We demonstrate fabrication of a variety of complex hollow geometries with cross-sectional features ranging from tens of micrometer to hundreds of micrometers in size. With the framework presented, this method may be employed for 3D printing functional hollow geometries for a variety of applications, and with improved freedom over the printing process (e.g. material choices, speed and resulting properties of the printed parts).
“…However, this study only characterized the static performance of these geometries and not the elastic wave transmission. A similar study conducted by Xu et al., [ 410 ] however, fabricated and experimentally characterized the elastic wave propagation through a minuscule 3D metamaterial whose intrinsic material was a magnetoelastomer (Figure 10h). The geometry under consideration was a well‐known negative stiffness lattice that has configurable shapes for different magnetic fields, resulting in different transmission ratios.…”
Section: Contemporary Avenues For Elastic Bandgap Engineeringmentioning
In solid state physics, a bandgap (BG) refers to a range of energies where no electronic states can exist. This concept was extended to classical waves, spawning the entire fields of photonic and phononic crystals where BGs are frequency (or wavelength) intervals where wave propagation is prohibited. For elastic waves, BGs are found in periodically alternating mechanical properties (i.e., stiffness and density). This gives birth to phononic crystals and later elastic metamaterials that have enabled unprecedented functionalities for a wide range of applications. Planar metamaterials are built for vibration shielding, while a myriad of works focus on integrating phononic crystals in microsystems for filtering, waveguiding, and dynamical strain energy confinement in optomechanical systems. Furthermore, the past decade has witnessed the rise of topological insulators, which leads to the creation of elastodynamic analogs of topological insulators for robust manipulation of mechanical waves. Meanwhile, additive manufacturing has enabled the realization of 3D architected elastic metamaterials, which extends their functionalities. This review aims to comprehensively delineate the rich physical background and the state-of-the art in elastic metamaterials and phononic crystals that possess engineered BGs for different functionalities and applications, and to provide a roadmap for future directions of these manmade materials.
“…A custom bottom-up multi-material projection microstereolithography (PμSL) system [22,27] was used to fabricate the octets presented in this work. First, a computer-aided design model was sliced into two different groups of enclosed images such that each group represented one material.…”
Charge‐programmed 3D printing enables the fabrication of 3D electronics with lightweight and high precision via selective patterning of metals. This selective metal deposition is catalyzed by Pd nanoparticles that are specifically immobilized onto the charged surface and promises to fabricate a myriad of complex electronic devices with self‐sensing, actuation, and structural elements assembled in a designed 3D layout. However, the achievable property space and the material‐performance correlation of the charge‐programmed printing remain unexplored. Herein, a series of photo‐curable resins are designed for unveiling how the charge and crosslink densities synergistically impact the nanocatalyst‐guided selective deposition in catalytic efficiency and properties of the 3D printed charge‐programmed architectures, leading to high‐quality 3D patterning of solid and liquid metals. The findings offer a wide tunability of the structural properties of the printed electronics, ranging from stiff to extreme flexibility. Capitalizing on these results, the printing and successful application of an ultralight‐weight and deployable 3D multi‐layer antenna system operating at an ultrahigh‐frequency of 19 GHz are demonstrated.
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