Verification of 2-D MEMS model using optical profiling techniques

Hill, M.T.; O’Mahony, Conor; Berney, Helen; Hughes, Padraig J.; Hynes, E.; Lane, W.A.

doi:10.1016/s0143-8166(01)00036-7

Cited by 18 publications

(8 citation statements)

References 6 publications

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“…1). After reflection, the light beams recombine inside the interferometer, thereby undergoing constructive and destructive interference and producing light and dark fringe patterns [14]. Surfaces of the dummy silicon dies (3.5x3.5 mm 2 ) in the ceramic packages were profiled for stress testing.…”

Section: Methodsmentioning

confidence: 99%

Tailoring of Stress Development in MEMS Packaging Systems

et al. 2002

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A better understanding of the origin and evolution of the stresses is a crucial step in improving reliability of packaging systems for microelectromechanical systems (MEMS). Given its importance, we examine the stresses developed in hermetically packaged MEMS inertial sensors. For this purpose, an optical surface profilometer is employed to assess the stresses by measuring the curvature of dummy silicon dies (3.5x3.5 mm 2 ) assembled in different types of packages and die attach adhesives. We also explore a temporal evolution of stresses during thermal exposure of the test packages in an effort to emulate actual packaging processes and device operation conditions. The result shows different levels of stresses generated from various adhesives and package types, and also a stress evolution during packaging processes. The mechanical stress data also show a good agreement with MEMS performance data obtained from actual accelerometers. Therefore, the stress data will not only be useful in better understanding performance of MEMS packages, but the testing protocol can also provide a diagnostic tool for very small packaging systems.

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Section: Methodsmentioning

confidence: 99%

Tailoring of Stress Development in MEMS Packaging Systems

et al. 2002

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“…A variety of different techniques have been developed, each with different advantages and drawbacks dependent on the specific application [1][2][3][4][5][6][7][8][9]. Stereo imaging [10][11][12][13][14] is perhaps the most wellknown technique, which uses multiple images obtained simultaneously from different viewpoints to reconstruct a 3D scene.…”

Section: Introductionmentioning

confidence: 99%

3D single-pixel video

Zhang

Edgar

Sun

et al. 2016

J. Opt.

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Photometric stereo is an established three-dimensional (3D) imaging technique for estimating surface shape and reflectivity using multiple images of a scene taken from the same viewpoint but subject to different illumination directions. Importantly, this technique requires the scene to remain static during image acquisition otherwise pixel-matching errors can introduce significant errors in the reconstructed image. In this work, we demonstrate a modified photometric stereo system with perfect pixel-registration, capable of reconstructing 3D images of scenes exhibiting dynamic behavior in real-time. Performing high-speed structured illumination of a scene and sensing the reflected light with four spatially-separated, single-pixel detectors, our system reconstructs continuous real-time 3D video at ∼8 frames per second for image resolutions of 64×64 pixels. Moreover, since this approach does not use a pixelated camera sensor, it can be readily extended to other wavelengths, such as the infrared, where camera technology is expensive.S Online supplementary data available from stacks.iop.org/JOPT/18/035203/mmedia

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“…A typical SWLI application is quality control of microelectronics components, for which the method's ability to characterize mm 2 size areas rapidly and its capacity to measure tall steps are important [1][2][3]. SWLI can measure layered structures [4,5] if the light used penetrates the sample.…”

Section: Introductionmentioning

confidence: 99%

Infrared scanning white light interferometry using a solid state light source

et al. 2011

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Scanning White Light Interferometry (SWLI) allows surface characterization of MEMS components. With transparent samples SWLI can image multiple stacked layers. However, since silicon is opaque to visible wavelengths, only the top layer can be measured using visible light. We combined multiple infrared light emitting diodes (IR-LEDs) to achieve adjustable IR illumination. This allows simultaneous measurement of top and bottom surface topographies of silicon samples -such as MEMS membranes-using a SWLI equipped with an IR camera. This advances the state of the art of the field of MEMS characterization by allowing looking under membranes of these devices during operation.

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Verification of 2-D MEMS model using optical profiling techniques

Cited by 18 publications

References 6 publications

Tailoring of Stress Development in MEMS Packaging Systems

Tailoring of Stress Development in MEMS Packaging Systems

3D single-pixel video

Infrared scanning white light interferometry using a solid state light source

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