2023
DOI: 10.1109/ted.2023.3279059
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Vertical GaN Schottky Barrier Diode With Record High Figure of Merit (1.1 GW/cm2) Fully Grown by Hydride Vapor Phase Epitaxy

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Cited by 11 publications
(4 citation statements)
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“…Cr and p‐Mo x Re 1‐x S 2 , as well as Ti/Al/Ni/Au and GaN, form ohmic contacts, respectively. [ 41,100 ] For testing purposes, one end of the electrode was connected to the top of the 2D material, while the other end was attached to the bottom of the GaN substrate. Impressively, this configuration yielded a remarkable reduction in the dark current, reaching an extremely low value of 0.13 nA.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Cr and p‐Mo x Re 1‐x S 2 , as well as Ti/Al/Ni/Au and GaN, form ohmic contacts, respectively. [ 41,100 ] For testing purposes, one end of the electrode was connected to the top of the 2D material, while the other end was attached to the bottom of the GaN substrate. Impressively, this configuration yielded a remarkable reduction in the dark current, reaching an extremely low value of 0.13 nA.…”
Section: Resultsmentioning
confidence: 99%
“…This draws inspiration from prior work on vertical GaN power devices. [ 98–100 ] The electric field distribution in vertical devices is relatively uniform, enabling a more expansive current spread. Lateral heterojunction devices necessitate dry etching processes to establish contacts between different materials, which can leave lattice damage on the etched surface, introducing trap states, resulting in increased leakage current, and delaying switching rates.…”
Section: Resultsmentioning
confidence: 99%
“…A number of studies have been carried out to address these issues. In terms of GaN epitaxial growth, vertical GaN-based SBDs fabricated by homogeneous epitaxy of high-quality GaN drift layers on GaN substrates have achieved the highest BFOM of 1.1 GW cm −2 in vertical GaN devices [96]. The QST (Qromis substrate technology) substrate technology is proposed to grow GaN on Si substrate, which can reduce parasitic effects, has high thermal conductivity and the ability to grow thick buffer layers [97], and it has been proved that high performance GaN-based devices can be fabricated based on this method [98].…”
Section: Summary and Prospectsmentioning
confidence: 99%
“…Several research groups have fabricated fully vertical devices on native GaN substrates or pseudo-vertical devices on foreign substrates, such as sapphire and silicon, in recent times [6][7][8][9]. However, the lack of understanding of the relationship between material processing and the underlying physics is hindering the widespread adoption of these devices.…”
Section: Introductionmentioning
confidence: 99%