Vertical link solutions for multilayer optical-networks-on-chip topologies

Parini, Alberto; Calò, Giovanna; Bellanca, Gaetano; Petruzzelli, V.

doi:10.1007/s11082-013-9826-6

Cited by 15 publications

(4 citation statements)

References 17 publications

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“…Multi-layer deposited silicon was recently proposed to improve the implementation of ONoCs by reducing the insertion loss induced by the waveguide crossing in the same layer [6] (typically around 0.05dB [6]). Optical vias allow signals to propagate from a layer to another at the price of some losses (typically around 0.1dB [17]), which thus results in a significant reduction in the number of waveguide crossings to reduce the total loss of the whole optical path. Following this idea, MPNOC [21] was proposed to realize energyefficient communications.…”

Section: B Onoc Relying On Multi-layer Deposited Siliconmentioning

confidence: 99%

“…Existing optical crossbar implementations show different tradeoffs between design complexity and energy efficiency and demonstrate a relatively poor scalability. Emerging design technology relying on multi-layer deposited silicon allows efficient stacking of optical layers connected by optical vias (optical vertical coupler) [17]. This technology allows reducing the number of waveguide crossings which is a main loss source in ONoC.…”

Section: Introductionmentioning

confidence: 99%

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Energy-efficient optical crossbars on chip with multi-layer deposited silicon

Beux

Nicolescu

et al. 2015

The 20th Asia and South Pacific Design Automation Conference

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-The many cores design research community have shown high interest in optical crossbars on chip for more than a decade. Key properties of optical crossbars, namely a) contention-free data routing b) low-latency communication and c) potential for high bandwidth through the use of WDM, motivate several implementations. These implementations demonstrate very different scalability and power efficiency ability depending on three key design factors: a) the network topology, b) the considered layout and c) the insertion losses induced by the fabrication process. The emerging design technique relying on multi-layer deposited silicon allows reducing optical losses, which may lead to significant reduction of the power consumption. In this paper, multi-layer deposited silicon based crossbars are proposed and compared. The results indicate that the proposed ring-based network exhibits, on average, 22% and 51.4% improvement for worst-case and average losses respectively compared to the most power-efficient related crossbars.

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Section: B Onoc Relying On Multi-layer Deposited Siliconmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Energy-efficient optical crossbars on chip with multi-layer deposited silicon

Beux

Nicolescu

et al. 2015

The 20th Asia and South Pacific Design Automation Conference

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“…Various components are integrated in a 3D photonic communication network, for example, modulators, , switches, , and filters. , The vertical router needed to establish interlayer links between stacked layers is the key component therein. Many solutions have been proposed for this router, such as microring vertical couplers, − vertical coupling waveguides, , and through-silicon photonic vias . However, strict requirements for the vertical coupling distance and fabrication difficulties limit the applicability of these solutions.…”

Section: Introductionmentioning

confidence: 99%

In Situ Assembling of Glass Microspheres and Bonding Force Analysis by the Ultraviolet–Near-Infrared Dual-Beam Optical Tweezer System

2021

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Microresonators show great potential as interlayer routing solutions for multilayered three-dimensional (3D) photonic communication networks. New techniques are needed for the convenient and in situ manipulation and immobilization of glass microspheres into functional structures. Herein, near-infrared (NIR) and ultraviolet (UV) lasers were used as optical tweezers to precisely arrange silica microspheres and UV-initiated immobilization in a 3D space. The NIR laser was used to trap targeted microspheres, and the UV laser was focused to immobilize the trapped microspheres in 3-methacryloxypropyltrimethoxysilane (MOPS) in ∼6 s. Optical force spectroscopy was performed using the optical tweezers to measure individual bond strength. Next, functional triangular pedestals were designed to flexibly control the gap space for vertical router applications in 3D photonic networks. Thus, the designed UV–NIR dual-beam optical tweezer system can be used to assemble arbitrary functional 3D structures, making it a valuable tool for microfabrication, photonics, and optical communication applications.

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“…In this paper we present a placement and routing algorithm, which places the optical devices overlap-free inside the footprint area and routes the waveguide. Although first contributions about multiple optical layers and multi-layer optical devices have been presented in recent literature [Biberman et al 2011b] [Biberman et al 2011a] [Parini et al 2014], we focus on systems with one optical layer to reduce manufacturing costs. All optical devices and waveguides are located on this single optical layer.…”

Section: Introductionmentioning

confidence: 99%

Proton+

Beuningen

Ramini

Bertozzi

et al. 2015

J. Emerg. Technol. Comput. Syst.

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Optical Networks-on-Chip (ONoCs) are a promising technology to overcome the bottleneck of low bandwidth of electronic Networks-on-Chip. Recent research discusses power and performance benefits of ONoCs based on their system-level design, while layout effects are typically overlooked. As a consequence, laser power requirements are inaccurately computed from the logic scheme but do not consider the layout. In this article, we propose PROTON+, a fast tool for placement and routing of 3D ONoCs minimizing the total laser power. Using our tool, the required laser power of the system can be decreased by up to 94% compared to a state-of-the-art manually designed layout. In addition, with the help of our tool, we study the physical design space of ONoC topologies. For this purpose, topology synthesis methods (e.g., global connectivity and network partitioning) as well as different objective function weights are analyzed in order to minimize the maximum insertion loss and ultimately the system’s laser power consumption. For the first time, we study optimal positions of memory controllers. A comparison of our algorithm to a state-of-the-art placer for electronic circuits shows the need for a different set of tools custom-tailored for the particular requirements of optical interconnects.

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Vertical link solutions for multilayer optical-networks-on-chip topologies

Cited by 15 publications

References 17 publications

Energy-efficient optical crossbars on chip with multi-layer deposited silicon

Energy-efficient optical crossbars on chip with multi-layer deposited silicon

In Situ Assembling of Glass Microspheres and Bonding Force Analysis by the Ultraviolet–Near-Infrared Dual-Beam Optical Tweezer System

Proton+

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