Vertically Aligned Al₂O₃ Fiber Framework Leading to Anisotropically Enhanced Thermal Conductivity of Epoxy Composites

Abstract

With the development of the modern electronic devices, efficient heat removal via thermal management materials in a low filling load has become one of the most critical challenges. Herein, a biomass template method is used to produce 3D alumina skeleton with one‐directionally arranged alumina fibers as the thermal conductive filler of epoxy composites. Thermal conductive composites with anisotropically enhanced thermal conductivity are prepared by impregnating epoxy resin into the 3D alumina skeleton. At an alumina load of 17.7 wt%, the composite exhibits a high out‐of‐plane thermal conductivity of 0.72 W m−1 K−1 (3.27 times of pure epoxy) and an in‐plane thermal conductivity of 0.38 W m−1 K−1, respectively. When compared with literatures in terms of the thermal conductivity enhancement per unit mass of filler, the samples are on the top. By using the biomass template method to construct 3D anisotropic structure, it is effective to improve the out‐of‐plane thermal conductivity of the composites, which exhibits strong potential for thermal management applications.

Enhanced thermal management in electronic devices through control-oriented structures

“…This 3D anisotropic structure effectively enhanced the through-plane thermal conductivity of the composite by 3.27 times. 25…”

“…19–22 Through further structural optimization, the fillers can be aligned in a specific direction, resulting in high thermal conductivity in that particular orientation. 23–26…”

“…[19][20][21][22] Through further structural optimization, the llers can be aligned in a specic direction, resulting in high thermal conductivity in that particular orientation. [23][24][25][26] Materials with an oriented structure can be obtained through a variety of methods (Fig. 1).…”

Al2O3/h‐BN/epoxy based electronic packaging material with high thermal conductivity and flame retardancy

“…This puts forward strict requirements for electronic packaging materials, which should not only exhibit high thermal conductivity for efficient heat dissipation, but also high flame retardancy in case of thermal runaway 7 . Epoxy resin (EP) has merits of low price, simple curing molding process, high adhesion, good stability, good chemical resistance, high mechanical performance, excellent insulation performance and so on, thus is widely used as electronic packaging materials 8,9 . However, its low thermal conductivity (e.g., ~0.2 W/mK at room temperature) 10–12 and highly flammable nature lag 13 far behind the requirement for efficient thermal dissipation of electronic devices, which limits their applicability in electronic packing field 14–17 .…”

Evolution mechanism of compression deformation of carbon black reinforced epoxy resin composites

“…How-ever, the three-dimensional network structure of traditional epoxy resin leads to high brittleness and poor toughness after curing, which undermines the impact damage resistance of epoxy resin materials inferior and significantly limits the practical application of epoxy resin in various fields. In recent years, the research on epoxy resin reinforcement and modification in various fields has been gradually focused [22][23][24][25][26].…”