Vertically Aligned Graphene-based Thermal Interface Material with High Thermal Conductivity

Wang, Nan; Chen, Shujing; Nkansah, Amos; Wang, Qianlong; Wang, Xitao; Chen, Miaoxiang; Ye, Lilei; Liu, Johan

doi:10.1109/therminic.2018.8593303

Cited by 6 publications

(7 citation statements)

References 9 publications

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“…Hence, thermal conductivity is described as follows: (9) In conclusion, the coating 1 results in a thermal conductivity of 1.88 W/m•K and a total thickness of 15 μm, whereas coating 2 results in a thermal conductivity of 1.54 W/m•K and a total thickness of 25 μm.…”

Section: B Thermal Conductivitymentioning

confidence: 99%

“…Graphene volume ratios (V G ) is crucial for the improvement of thermal conductivity. [9] has shown that by changing V G from 30% to 75% an increase of ≈1200 W/m•K was achieved. Concluding that graphene enhanced TIM can reach through plane thermal conductivity up to 1000 W/m•K, whereas in plane thermal conductivity up to 5000 W/m•K can be reached [10].…”

Section: Introductionmentioning

confidence: 99%

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Experimental Performance Analysis of Advanced Layers for Electronic Circuit Boards

Klarmann

Vagapov

Gotzig

2019

2019 54th International Universities Power Engineering Conference (UPEC)

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This paper provides an experimental performance analysis of advanced layers for electronic circuit boards. The base material of the advanced layers used in the experiments is Al-5052, with the dimensions of 100mm x 20mm x 1mm. As insulating material between the base and conductor, two aluminium coatings were investigated and the surface structure and thermal conductivity of the coatings were examined. Furthermore, three electroconductive adhesives were applied onto the coatings. Initially, electrical performance is investigated and electrical components were applied onto the new surface structure. Finally, the environmental tests were performed to determine the robustness of the evaluated system.

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Section: B Thermal Conductivitymentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Experimental Performance Analysis of Advanced Layers for Electronic Circuit Boards

Klarmann

Vagapov

Gotzig

2019

2019 54th International Universities Power Engineering Conference (UPEC)

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“…Diamond possesses outstanding physical properties, with a room temperature thermal conductivity of 2200 W/(m·K) and a thermal expansion coefficient of 0.8 × 10 −6 /K. Compared with 2D materials such as graphene, no anisotropy exists in the packaging materials prepared by diamond [ 2 , 3 , 4 ]. The diamond-reinforced aluminum matrix composites developed thus become the representative of a new generation of thermal management materials.…”

Section: Introductionmentioning

confidence: 99%

Effect of Nanoscale W Coating on Corrosion Behavior of Diamond/Aluminum Composites

et al. 2023

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The stability of diamond/aluminum composite is of significant importance for its extensive application. In this paper, the interface of diamond/aluminum composite was modified by adding nanoscale W coating on diamond surface. We evaluated the corrosion rate of nanoscale W-coated and uncoated diamond/aluminum composite by a full immersion test and polarization curve test and clarified the corrosion products and corrosion mechanism of the composite. The introduction of W nanoscale coating effectively reduces the corrosion rate of the diamond/aluminum composite. After corrosion, the bending strength and thermal conductivity of the nanoscale W-coated diamond/aluminum composite are considerably higher than those of the uncoated diamond/aluminum composite. The corrosion loss of the material is mainly related to the hydrolysis of the interface product Al4C3, accompanied by the corrosion of the matrix aluminum. Our work provides guidance for improving the life of electronic devices in corrosive environments.

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“…The cross-stacking technique can realize the vertical orientation of graphite films and utilize the high thermal conductivity of graphite film to its full potential. Frankly speaking, there have been a lot of studies about the orientation of graphene or graphite. − Graphene is a two-dimensional and anisotropic material, the orientation can be classified as in-plane orientation , and vertical orientation. − In this study, we focused on the vertical orientation. Balandin et al achieved vertical orientation with the help of the magnetic field.…”

Section: Introductionmentioning

confidence: 99%

“…However, the fillers they used is in the form of micro flakes, as a result, the filler loading was very low. Liu et al developed a vertically aligned graphene-based TIM, in which the surface of graphene is covered with a thin metal layer to minimize the contact resistance. However, the studies , showed that the thermal contact resistance of the metal-covered TIMs may increase dramatically after several times of thermal cycling.…”

Section: Introductionmentioning

confidence: 99%

Thermal Interface Materials with Both High Through-Plane Thermal Conductivity and Excellent Elastic Compliance

Zhang

Liang

et al. 2021

Chem. Mater.

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With the development of microprocessors toward higher power, larger chip, and higher frequency, heat dissipation is one of the central issues. Thermal interface materials (TIMs), which are used between the chip and the heat spreader and between the heat spreader and the heat sink, play an increasingly important role in microprocessor cooling. Currently, most of the research has primarily dealt with understanding the thermal conductivity of TIMs. For thermal design, elastic compliance is also important because excellent elastic compliance can reduce thermal contact resistance and relieve the warpage failure caused by stress concentration. However, high thermal conductivity and excellent elastic compliance are usually mutually exclusive in TIMs. Herein, we report a TIM made from vertically oriented graphite and polybutadiene that shows high through-plane thermal conductivity of 64.90 W·m–1·K–1, excellent elastic compliance with only 93 kPa stress at 50% compressive strain similar to soft biological tissues, and outstanding compression resilience performance (storage modulus 220 kPa and mechanical loss factor 0.226). These excellent properties result from the vertical orientation of graphite films in polybutadiene, strong interfacial strength between graphite films and polybutadiene, and the minimized negative impact of graphite on the intrinsic mechanical properties of polybutadiene by means of cross-stacking techniques. The optimal TIM is applied in CPU microprocessor cooling and exhibits superior heat dissipation capability, by up to 158 °C reduction of chip temperature comparing with polybutadiene. This work provides a high-performance TIM to meet specific requirements for high-performance computing, such as GPU, AI computing, and cloud computing.

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Vertically Aligned Graphene-based Thermal Interface Material with High Thermal Conductivity

Cited by 6 publications

References 9 publications

Experimental Performance Analysis of Advanced Layers for Electronic Circuit Boards

Experimental Performance Analysis of Advanced Layers for Electronic Circuit Boards

Effect of Nanoscale W Coating on Corrosion Behavior of Diamond/Aluminum Composites

Thermal Interface Materials with Both High Through-Plane Thermal Conductivity and Excellent Elastic Compliance

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