Very high-power-density CW operation of GaAs/AlGaAs microwave heterojunction bipolar transistors

Bayraktaroglu, B.; Barrette, J.; Kehias, L.; Huang, C.I.; Neidhard, R.; Scherer, R.

doi:10.1109/55.244741

Cited by 75 publications

(13 citation statements)

References 7 publications

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“…From a technological standpoint, the mitigation of currentgain collapse is often attained by increasing the thermal coupling between the various fingers, thus contrasting (e.g., by introducing a thermal shunt air-bridge [16] in the device layout) the onset of a temperature imbalance among the fingers. This technique has some advantages with respect to using an electrical negative feedback, e.g., emitter or base ballasting resistances that, in turn, compromise the device gain.…”

Section: B Stabilization and Electrothermal Oscillationsmentioning

confidence: 99%

Assessment of Thermal Instabilities and Oscillations in Multifinger Heterojunction Bipolar Transistors Through a Harmonic-Balance-Based CAD-Oriented Dynamic Stability Analysis Technique

Traversa

Cappelluti

Bonani

et al. 2009

IEEE Trans. Microwave Theory Techn.

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We present a novel analysis of thermal instabilities and oscillations in multifinger heterojunction bipolar transistors (HBTs), based on a harmonic-balance computer-aided-design (CAD)-oriented approach to the dynamic stability assessment. The stability analysis is carried out in time-periodic dynamic conditions by calculating the Floquet multipliers of the limit cycle representing the HBT working point. Such a computation is performed directly in the frequency domain, on the basis of the Jacobian of the harmonic-balance problem yielding the limit cycle. The corresponding stability assessment is rigorous, and the efficient calculation method makes it readily implementable in CAD tools, thus allowing for circuit and device optimization. Results on three-and four-finger layouts are presented, including closed-form oscillation criteria for two-finger devices.

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Section: B Stabilization and Electrothermal Oscillationsmentioning

confidence: 99%

Assessment of Thermal Instabilities and Oscillations in Multifinger Heterojunction Bipolar Transistors Through a Harmonic-Balance-Based CAD-Oriented Dynamic Stability Analysis Technique

Traversa

Cappelluti

Bonani

et al. 2009

IEEE Trans. Microwave Theory Techn.

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“…The fourfinger cell described above was measured to be 400°C/W. The thermal resistance can be lowered by using [23,24] …”

Section: Power Hbt Unit-cellyfeaturesmentioning

confidence: 99%

Design Considerations for High Efficiency GaAs HBT MMIC Power Amplifiers

Ali

1994

24th European Microwave Conference, 1994

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“…Next, as shown in Fig. 3(b), if these via holes are located close to the transistor and consist of a thick metal, the heat generated in the transistor junction is effectively conducted to the broad surface ground plane through the via holes, like the heat spreading technique of high power HBTs [5]. Then, the heat travels to a mounting substrate through a number of ground connecting bumps like thermal bumps [6].…”

Section: Introductionmentioning

confidence: 99%

Multilayer MMIC for stacked integrated circuits

Imaoka¹,

Minakawa

Imai³

1996

26th European Microwave Conference, 1996

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In the flip-chip mounting of MMIC chips, an adequate separation between the flip chip and the mounting substrate must be maintained to prevent undesirable loading effects. In this paper, as an approach to solve this restriction, an electrically shielded MMIC is presented. This can be realized employlng multilayer MMIC technology. An electrically shielded MMIC amplifier has been designed and fabricated, and satisfactory performance with excellent designability has been obtained. Furthermore, by using the electrically shielded MMICs, a novel high-density IC module construction providing excellent electrical and thermal functions, named "Stacked Integrated Circuits", is proposed.

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Very high-power-density CW operation of GaAs/AlGaAs microwave heterojunction bipolar transistors

Cited by 75 publications

References 7 publications

Assessment of Thermal Instabilities and Oscillations in Multifinger Heterojunction Bipolar Transistors Through a Harmonic-Balance-Based CAD-Oriented Dynamic Stability Analysis Technique

Assessment of Thermal Instabilities and Oscillations in Multifinger Heterojunction Bipolar Transistors Through a Harmonic-Balance-Based CAD-Oriented Dynamic Stability Analysis Technique

Design Considerations for High Efficiency GaAs HBT MMIC Power Amplifiers

Multilayer MMIC for stacked integrated circuits

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