1985
DOI: 10.1111/j.1365-2818.1985.tb02573.x
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Very low voltage sputter coating

Abstract: SUMMARY Very low voltage sputter coating, in the range 175–300 V, has been used to produce finely structured thin films of noble and refractory metals for use in high resolution scanning electron microscopy. There is a marked diminution in the particle size with a decrease in cathode voltage. Although the sputtering times are longer than with conventional diode sputter coating, such times are shorter than those required to produce similar films by Penning or ion‐beam sputtering. The refractory metals produce f… Show more

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Cited by 9 publications
(10 citation statements)
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“…The fact that ion beam sputter coating produces finer grained thick platinum and gold films than diode sputter coating, and very fine grained tungsten films, has been well documented (Kanaya et al, 1974;Geller et al, 1979;Franks et al, 1980;Clay & Peace, 1981;Echlin et al, 1982). However, our low energy input diode sputter coated tungsten showed a significant improvement on other published work.…”
Section: Discussionsupporting
confidence: 63%
See 1 more Smart Citation
“…The fact that ion beam sputter coating produces finer grained thick platinum and gold films than diode sputter coating, and very fine grained tungsten films, has been well documented (Kanaya et al, 1974;Geller et al, 1979;Franks et al, 1980;Clay & Peace, 1981;Echlin et al, 1982). However, our low energy input diode sputter coated tungsten showed a significant improvement on other published work.…”
Section: Discussionsupporting
confidence: 63%
“…The cool nature of the technique was also clearly demonstrated by coating expanded polystyrene latex, a heat sensitive specimen, without damage. They did not assess the grain size or film structure but Echlin and co-workers have done so with 'low voltage' sputter coating (Echlin, 1981;Echlin et al, 1982). The grain size of nominally 10 or 15 nm thick films was reduced by deposition at low voltages but the sputtering rates achieved were considerably less than achieved by Robards et al (1981).…”
Section: Introductionmentioning
confidence: 99%
“…Although several authors have concluded that ion beam sputtering gives finer grained coatings than other sputtering methods (Geller et al, 1979;Franks et al, 1980;Clay and Peace, 1981;Evans and Franks, 1981;Echlin et al, 1982;Kemmenoe and Bullock, 19831, this conclusion is based upon studies in which the two types of sputtering were carried out under quite different conditions. Sputtering is a complex process, and in order to make comparisons, one must keep as many variables as possible constant when comparing different methods.…”
Section: Metal Coating For High Resolution Emmentioning
confidence: 87%
“…Surprisingly, even such a thin layer proved sufficient to avoid charging artefacts on a large bulk sample. This may be due to: (i) fracture faces of frozen-hydrated samples are much flatter than surfaces of dried specimens, thus the coating layer is formed quite uniformly; (ii) due to the presence of water the electrical conductivity of a frozenhydrated specimen may be larger than after dehydration (Walther et al, 1990); (iii) the grain size of sputter-coated films becomes finer at lower specimen temperatures facilitating coalescence of the metal film (Echlin et al, 1985;Muller & Walther, 1989).…”
Section: Coating and Observation In Semmentioning
confidence: 99%