Virtual life assessment of electronic hardware used in the Advanced Amphibious Assault Vehicle (AAAV)

Valentin, Ricky; Cunningham, J.; Osterman, Michael; Dasgupta, Abhijit; Pecht, Michael; Tsagos, Dinos

doi:10.1109/wsc.2002.1172985

Cited by 8 publications

(3 citation statements)

References 6 publications

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“…By analyzing the board-level's vibration characteristics, the fatigue life, Nfi'h of the electrical interconnect parts can be calculated by the following equation [5], where x and yare the location of the component on board, C is empirically determined constant, b is the fatigue index, ZI and Z2 are coefficients determined by the power spectral density, the minimum natural frequency, the circuit board thickness, the solder joint shape and other information.…”

Section: B Environment Condition and Stress Analysismentioning

confidence: 99%

A new electronic product PHM analytical object identifying method based on failure of physics and simulation

Jin

Kang

2012

Proceedings of the IEEE 2012 Prognostics and System Health Management Conference (PHM-2012 Beijing)

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It's essential to identify the vital parts at the blue-print stage of electronic products before the engineers scheme out any method of product fault prognostication and health management.Currently, the vital parts, which are expensive, fragile, or with complex and critical functions, can be confirmed through experience, field data or FMEA method. This paper presents a new method to provide a list contains all components and potential failure points which need to be paid attention to at the scheming stage. The electronic designers can make a decision if the weak points of the electronic product are possible and necessary to take any prognostication and health management technique. In this method, Numerical Heat Transfer (NHT) andFinite Element Analysis (FEA) have to be applied on the electronic product to obtain the localized environment condition firstly. And based on the failure of physics theory, various failure models, which describe material thermal mismatch as well as the fatigue crack caused by vibration, can be used to identify the failure time, failure mode and mechanism of every component and other potential failure points. Consequently, the vital parts of the electronic product which work under harsh environment and may lead to critical failure can be focused seriously, while the capacity parameters should be monitored during the whole Iife cycle. Additionally, the alternative method shown in this paper is applied on an avionic printed circuit assembly as the cased study.

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Section: B Environment Condition and Stress Analysismentioning

confidence: 99%

A new electronic product PHM analytical object identifying method based on failure of physics and simulation

Jin

Kang

2012

Proceedings of the IEEE 2012 Prognostics and System Health Management Conference (PHM-2012 Beijing)

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“…This software has been used successfully in the past to conduct virtual qualification of electronic hardware. [2][3][4][5][6][7] The software consists of a set of simulation tools that use various thermal and mechanical stress and damage models. 4 Appropriate damage models are used to calculate the damage caused due to each type of life cycle load condition experienced by the circuit card.…”

Section: Introductionmentioning

confidence: 99%

“…[2][3][4][5][6][7] The software consists of a set of simulation tools that use various thermal and mechanical stress and damage models. 4 Appropriate damage models are used to calculate the damage caused due to each type of life cycle load condition experienced by the circuit card. Assuming the future life cycle loading conditions will follow the same pattern as the past load history, the total damage accumulated for one future life cycle is calculated.…”

Section: Introductionmentioning

confidence: 99%

Virtual Remaining Life Assessment of Electronic Hardware Subjected to Shock and Random Vibration Life Cycle Loads

Mathew

Das

Osterman

et al. 2007

Journal of the IEST

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KEYWORDSRemaining life, shock, random vibration, solder interconnects, life cycle, damage INTRODUCTIONThe reliable life of an electronics product is a function of the stresses the product experiences during its lifetime, including manufacture, assembly, testing, storage, handling, transportation, and operation. The effect of the stresses can be manifested as degradation in performance or gradual loss of durability of the elements in the product. Accumulated damage is another measure of degradation that often cannot be directly detected by performance loss. Damage can occur and accumulate during the life phases and affect the reliability of the electronic hardware.1 In order to quantify the damage accumulated in the electronic hardware and to determine how long the hardware can operate without failure under similar stresses in the future, a remaining life assessment needs to be conducted. A remaining life assessment estimates the ability of the electronic hardware to meet the required performance specifications in the life cycle application environment for the remaining service life of the product.

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Prognostic and health management for avionics

Wilkinson

Humphrey²,

Vermeire³

et al.

2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720)

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Virtual life assessment of electronic hardware used in the Advanced Amphibious Assault Vehicle (AAAV)

Cited by 8 publications

References 6 publications

A new electronic product PHM analytical object identifying method based on failure of physics and simulation

A new electronic product PHM analytical object identifying method based on failure of physics and simulation

Virtual Remaining Life Assessment of Electronic Hardware Subjected to Shock and Random Vibration Life Cycle Loads

Prognostic and health management for avionics

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